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Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
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Recognizing IPC Scholarships, Awards, and Opportunities
May 21, 2025 | Charlene Gunter du Plessis, IPC Education FoundationEstimated reading time: 1 minute
There was no better way to end our year in 2024 than by recognizing hard-working and driven students and educators for their involvement and interests in the electronics manufacturing industry. Through the IPC Scholarship and Awards program, we can help students invest in their future and reward their hardworking and dedicated accomplishments.
Scholarships are hugely important because they help students avoid and alleviate college debt and provide professional growth opportunities. In 2024, the IPC Education Foundation awarded more than $172,000 to deserving high school students, college/university students, student leaders, and educators.
2024 IPC Student Member Scholarship Winners
The IPC Education Foundation awarded 45 IPC Student Members with an IPC Student Member Scholarship at $1,000 each. The scholarship recipients are members at the following IPC Student Chapters: 36 from Auburn University; two from Purdue University; and one each from Binghamton University, California Polytechnic State University, Central Carolina Community College, Michigan Tech University, University of California-Irvine, University of Maryland, College Park, and University of Utah.
Click here to read the list of recipients.
This article originally appeared in the Spring 2025 issue of IPC Community.
Read more articles in the Spring issue:
- Life in the Fast Lane: Bill Cardoso is transforming roadsters into electric cars
- Future-proofing Electronics: Safer chemistries, more sustainability. Rachel Simon of ChemFORWARD details a new initiative
- Leadership That Inspires Change: Find out how Barry Matties used passion, creativity, and continuous improvement strategies to build I-Connect007 into the leading news organization for the electronics industry
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.