Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC

Estimated reading time: 3 minutes

Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.

Indium Corporation specializes in semiconductor packaging and assembly, offering a portfolio of advanced materials solutions. With a commitment to the full scope of semiconductor packaging and assembly applications, Indium Corporation offers right-sized options to align with nearly every application requirement, with a focus on sustainable, energy-efficient technology solutions.

The company will showcase the following among its featured products:

Flip-Chip Flux:

• NC-809 is a halogen-free, ultra-low residue flip-chip flux engineered with high-tack characteristics and designed to hold fine-pitch die or solder spheres in place without risk of shift during the assembly process. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps, which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.
• WS-446HF Flux is a robust, halogen-free, water-wash flux designed to provide one simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes. It has a powerful activator system to promote good wetting on even the most demanding substrate metallizations, such as Cu OSP, ENEPIG, and ENIG. Its rheology is suitable for dipping flip-chip applications, as well as pin transfer or printing BGA ball-attach applications, for sphere sizes 0.25mm and above. WS-446HF helps to improve production yield by minimizing non-wet open defects, missing balls, and electrochemical migration (ECM).

Sintering Paste:

• InBAKE™29 Cu sinter paste is developed for high-power die-attach applications and for applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperature. InBAKE™29 can be sintered either pressure-less or with pressure, under low oxygen atmospheres of O2 <500ppm. After 4,500 cycles TCT
• (-40°C–175°C), the die shear strength increases compared to time zero. Target applications include high-power die-attach (SiC MOSFET and Si IGBT), RF die-attach, and power LED die-attach.
• SiPaste® C312HF is a cleanable solder paste formulated for fine-aperture printing applications. This material exhibits optimum transfer efficiency with consistent printing stability after continuous use, a long stencil life of at least four hours without dry-out, and a benign, non-corrosive residue that can remain post-reflow without cleaning or be easily cleaned with semi-aqueous or saponifier technology.
• InFORCE® pressure sinter pastes are high-metal, low-organic content sinter materials available in both silver and copper. The benefits of a low-organic content composition include short drying for increased throughput and less volume reduction between wet and post-sintered deposits, meaning less paste can be used. The portfolio includes:
  - InFORCE®29 – a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
  - InFORCE®MF – a proven pressure Ag sinter paste designed for SiC die-attach application. InFORCE®MF is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.

Thermal Solutions:

• Solder TIMs deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, they enhance battery life, reduce cooling fan size, and minimize heat-sink mass, all while maintaining RoHS compliance and supporting step soldering requirements.
• Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle program.
• Heat-Spring® HSx is a compressible, non-reflow metal TIM designed for large-area dies with warpage of 200 microns or more. It delivers 16W/m-K thermal conductivity at just 20psi, making it ideal for test heads with clamping forces of 30psi or less. Available in thicknesses from 300 microns to 1mm, it can be customized with or without a diffusion barrier to prevent die staining.

Indium Corporation will also showcase Durafuse® HT, an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices.