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Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI
May 29, 2025 | Amphenol Printed CircuitsEstimated reading time: Less than a minute
Amphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.
Visitors to booth #1126 in the Moscone Center can see examples of PCBs for commercial and military applications, including high-speed-digital (HSD) circuits to 25 Gb/s, RF/microwave planar antenna arrays and beamforming networks to 40 GHz and beyond, and hybrid combinations of analog, digital, and RF/microwave assemblies precision designed, assembled, and tested in APC’s world-class facilities in Nashua, NH, Mesa AZ, and Nogales Mexico, delivering full turnkey assembles.
Maintaining strong relationships with leading circuit material suppliers and leveraging Amphenol’s vast portfolio of RF connectors and components, Amphenol Printed Circuits has designed and manufactured PCBs and backplanes for commercial and mission-critical Military applications for more than 30 years. Based on the latest low-loss rigid, flex, and rigid-flex circuit materials, and with low-profile copper, these cost-effective circuit solutions serve the most challenging requirements in aerospace/defense, industrial, space, and telecommunications applications.
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Rachael Temple - AlltematedSuggested Items
Green Circuits Boosts Midwest Presence with New Regional Sales Manager Ray Ponder
10/08/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced the appointment of Ray Ponder as Regional Sales Manager for the Midwest region.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/08/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing
10/07/2025 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of materials designed for coating, protecting, and securing components on printed circuit boards in satellites, missiles, and space applications.
American Standard Circuits to Exhibit at SMTA International
10/06/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Circuits/ASC Sunstone Circuits has announced that his company will once again exhibit at SMTA International 2025 to be held at the Donald E Stephens Convention Center in Rosemont, Illinois on October 19th through the 23rd, 2025.
Capital Electro-Circuits Achieves ITAR Registration to Strengthen Aerospace and Defense Capabilities
10/06/2025 | Capital Electro-CircuitsCapital Electro-Circuits, Inc. (CEC), a U.S.-based manufacturer of mission-critical printed circuit boards since 1985, announced that it is now officially registered with the U.S. Department of State, Directorate of Defense Trade Controls (DDTC) under the International Traffic in Arms Regulations (ITAR).