Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
Target Condition: The 5 Ws of PCB Design Constraints
Fresh PCB Concepts: More Than Compliance—A Human-centered Sustainability Approach
Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI
May 29, 2025 | Amphenol Printed CircuitsEstimated reading time: Less than a minute
Amphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.
Visitors to booth #1126 in the Moscone Center can see examples of PCBs for commercial and military applications, including high-speed-digital (HSD) circuits to 25 Gb/s, RF/microwave planar antenna arrays and beamforming networks to 40 GHz and beyond, and hybrid combinations of analog, digital, and RF/microwave assemblies precision designed, assembled, and tested in APC’s world-class facilities in Nashua, NH, Mesa AZ, and Nogales Mexico, delivering full turnkey assembles.
Maintaining strong relationships with leading circuit material suppliers and leveraging Amphenol’s vast portfolio of RF connectors and components, Amphenol Printed Circuits has designed and manufactured PCBs and backplanes for commercial and mission-critical Military applications for more than 30 years. Based on the latest low-loss rigid, flex, and rigid-flex circuit materials, and with low-profile copper, these cost-effective circuit solutions serve the most challenging requirements in aerospace/defense, industrial, space, and telecommunications applications.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Atg Launches Latest Large Format Test System, A9XL, with 8 Heads and 48” x 26” Panel Capability
08/01/2025 | atg Luther & Maelzer GmbHatg Luther & Maelzer GmbH (a Mycronic company) is proud to roll out a new large format test system generation based on the latest high speed atg A9 (board size up to 24” x 21”) and A9L platform.
Advint and Sayron Bring Advanced Rectifier Solutions to High-Reliability PCB Manufacturers
08/01/2025 | Advint IncorporatedAdvint Incorporated has partnered with Sayron, a leading global rectifier manufacturer, to supply cutting-edge IGBT-based DC rectifiers to high-performance PCB manufacturers across North America and beyond. Sayron’s precision-engineered rectifiers align with the stringent requirements of advanced PCB processes.
Direct Metallization: A Sustainable Shift in PCB Fabrication
07/31/2025 | Jim Watkowski, Harry Yang, and Mark Edwards, MacDermid Alpha Electronics SolutionsThe global electronics industry is undergoing a significant transformation, driven by the need for more resilient supply chains and environmentally sustainable manufacturing practices. Printed circuit boards (PCBs), the backbone of interconnection for electronic devices, are at the center of this shift. Traditionally, PCB fabrication has relied heavily on electroless copper, a process that, while effective, is resource-intensive and environmentally hazardous. In response, many manufacturers are turning to direct metallization technologies as a cleaner, more efficient alternative.
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
Solving the Toughest BGA Challenges in Electronics
07/30/2025 | Nash Bell, BEST Inc.Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.