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Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI
May 29, 2025 | Amphenol Printed CircuitsEstimated reading time: Less than a minute
Amphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.
Visitors to booth #1126 in the Moscone Center can see examples of PCBs for commercial and military applications, including high-speed-digital (HSD) circuits to 25 Gb/s, RF/microwave planar antenna arrays and beamforming networks to 40 GHz and beyond, and hybrid combinations of analog, digital, and RF/microwave assemblies precision designed, assembled, and tested in APC’s world-class facilities in Nashua, NH, Mesa AZ, and Nogales Mexico, delivering full turnkey assembles.
Maintaining strong relationships with leading circuit material suppliers and leveraging Amphenol’s vast portfolio of RF connectors and components, Amphenol Printed Circuits has designed and manufactured PCBs and backplanes for commercial and mission-critical Military applications for more than 30 years. Based on the latest low-loss rigid, flex, and rigid-flex circuit materials, and with low-profile copper, these cost-effective circuit solutions serve the most challenging requirements in aerospace/defense, industrial, space, and telecommunications applications.
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Rachael Temple - AlltematedSuggested Items
Eltek Receives Purchase Orders Totaling $2.4 Million
08/25/2025 | PRNewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, announced that it received orders totaling $2.4 million from a defense customer.
TTM Technologies: Bridging East and West with Strategic Expansion
08/25/2025 | Marcy LaRont, I-Connect007As global supply chains shift and demand for supply chain resiliency grows, TTM Technologies is expanding with purpose: bolstering its U.S. presence while maintaining a strong footprint in Asia. With recent moves in Wisconsin and Malaysia, the company is positioning itself to better support customers amid an evolving geopolitical landscape. In this interview, President and CEO of TTM Technologies Tom Edman discusses TTM’s expansion strategy, the future of manufacturing, and his planned retirement after his long tenure at the helm of the company.
CIMS to Exhibit at KPCA Show 2025
08/25/2025 | CIMSCIMS announced that it will exhibit at KPCA 2025, Korea’s premier annual PCB event, held this year in Incheon.
Global Flexible PCB Output Expected to Surpass $20 Billion by 2025, with AI Glasses Emerging as a New Growth Driver
08/25/2025 | TPCAThe Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute (ITRI) released the "2025 Global Flexible PCB Industry Outlook" in August.
MSU Leveraging Intel 16 and the Cadence Tool Flow for Academic Chip Tapeout
08/22/2025 | Cadence Design SystemsMorgan State University (MSU) recently received an Apple Innovation Grant, designed to support engineering schools as they develop their silicon and hardware technologies. The New Silicon Initiative (NSI) is designed to inspire and prepare students for careers in hardware engineering, computer architecture, and silicon chip design.