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Transforming PCB Design from Reactive to Predictive With Digital Twins

07/01/2026 | Stephen V. Chavez, Siemens EDA and PCEA
For decades, PCB development has largely followed a sequential process. Design teams create the schematic, develop the layout, fabricate prototypes, perform validation testing, identify problems, revise the design, and repeat the cycle until the product eventually meets specifications. While this approach has historically been accepted as normal, it is increasingly incompatible with modern product demands, where development speed, quality, and predictability define competitive advantage.

Target Condition: Signal Integrity Without Borders

06/24/2026 | Kelly Dack -- Column: Target Condition
I started my PCB design career in 1980, long before “signal integrity” became a formal discipline. Back then, we were trying to “connect the dots” on simple, two-sided PCB layouts using the new $80,000 interactive graphics terminals we called a CAD system. By the time PCB design conferences emerged in the 1990s, signal integrity had begun to formalize into a discipline of its own. Much of the early, visible thought leadership came from North America and parts of Europe.

Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions

06/18/2026 | Synopsys
Synopsys has announced the availability of its first Multiphysics Fusion™ solutions for customer deployment.

Navigating the Hidden Hurdles: Mastering Return Path Discontinuities for Robust Signal Integrity

05/26/2026 | Stephen V. Chavez, Siemens EDA and PCEA
In the race toward higher bandwidth, tighter form factors, and faster time-to-market, engineering teams focus heavily on device performance, routing density, and advanced materials. Yet one of the most critical determinants of system success remains largely invisible—and too often underestimated: the integrity of the return path. Signal integrity (SI) failures rarely originate from the signal trace alone. More often, they stem from what designers don’t see—the disruption of the signal’s return path. These disruptions, known as return path discontinuities, are a leading cause of late-stage failures, unexpected EMI issues, and costly respins.

Target Condition: The Modern Masters of Signal Integrity and AI-driven Design

05/21/2026 | Kelly Dack -- Column: Target Condition
Signal integrity (SI) in PCB design has moved from a niche engineering concern to the defining factor in whether modern electronics succeed or fail. As data rates push beyond PAM4 (4-level 112G) gigabit territory and SerDes components exhibit edge speeds as fast as 50–100 picoseconds, PCBs behave less like collections of simple traces and more like complex electromagnetic systems.
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