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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Standards: The Roadmap for Your Ideal Data Package
May 29, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
Whether you’re designing a simple commercial PCB or a cutting-edge board headed for Mars, you’ll still need to create the perfect design data package—hopefully one that’s complete and accurate.
In this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
Andy Shaughnessy: Kris, when it comes to creating the ideal design data package for your particular design, you say everyone will have a slightly different data package, because each design has different requirements. What do designers need to know about creating their ideal data package?
Kris Moyer: First, if you look in the IPC standards for documentation, especially the IPC-2610 series, we've defined various levels of documentation and what we call completeness. It's a grading system. The completeness mode defines whether you're at an engineering concept, consumer good level of documentation, a prototype level, or a full high-reliability production level, and what levels and types of information and completeness of information are needed.
So, having an understanding of that is definitely a good first step. Beyond that, it’s critical to know what markets you're in. For example, if you're in military and aerospace, where you need to define a product with a shelf life of a half-century and must be manufactured the same way for 50 years, you need a different level of documentation than a consumer good that will be obsolete in 18 months. Understanding your market segment, what is required of it, and the reliability goal all go back to IPC performance classifications.
To read the entire interview, which originally appeared in the May 2025 issue of Design007 Magazine, click here.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.