Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

KYZEN to Highlight MICRONOX MX2123 Power Module Cleaner at IMAPS Wire Bonding Workshop

04/29/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) Wire Bonding 2026 Workshop and Tabletop Exhibition, scheduled to take place May 12-13 at the Crowne Plaza Boston-Woburn in Woburn, MA.

Spirit Electronics Named Authorized Distributor for Microchip Technology

04/17/2026 | Globe Newswire
Spirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.

AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging

04/16/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.

Microchip Earns IEC 62443-4-1 ML2 Industrial Automation and Control System Certification

04/08/2026 | Microchip
As connected systems spread across residential, industrial and commercial environments, the need for independently verified cybersecurity assurance is becoming a core requirement.

Boston Micro Fabrication Introduces BMF Clear, Enabling Scalable Optical Microfabrication

04/07/2026 | Boston Micro Fabrication
Boston Micro Fabrication (BMF), the global leader in micro-precision 3D printing, announces the launch of the BMF Clear, an optically transparent photopolymer resin engineered for applications requiring exceptional light transmission and micron-level accuracy, such as microfluidics, photonics, advanced optical components, biomedical devices and more.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in