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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Micron Invests $250 Million in Trump Accounts for Children and Families

07/01/2026 | Micron
In honor of America’s 250th anniversary, Micron Technology, Inc. announced a $250 million investment to increase long-term savings opportunities for children and families through Trump Accounts (also known as 530A Accounts).

Base Material Properties and Microvia Reliability

07/01/2026 | Ed Kelley, Victory Giant Technology
The drive toward higher circuit density is challenging PCB manufacturers and their supply chains alike, with base materials as a critical foundation for complex designs. HDI designs present specific challenges and requirements for these materials, but given the myriad possible designs and applications, there is no optimal “one size fits all” material. Perhaps the most challenging HDI designs are those that use stacked vs. staggered microvias, with the number of layers of stacked microvias and the pitch between them as critical variables.

Teledyne MEMS Selected to Support Two FABrIC Challenge Award Recipients

06/29/2026 | BUSINESS WIRE
Teledyne MEMS announced that it has been selected as the advanced micro-electro-mechanical systems (MEMS) manufacturing partner for two recipients of the latest FABrIC Challenge funding awards announced by CMC Microsystems through the Government of Canada’s FABrIC initiative.

Microchip's Radiation-Tolerant Clock Generator Streamlines Spacecraft Timing

06/26/2026 | Microchip
Spacecraft timing systems must provide highly stable, precise signals for navigation, communications and scientific instruments, even when GNSS signals are weak or unavailable.

Henger Captivates the 2026 JPCA SHOW in Japan with Next‑Generation Plasma Technolog

06/19/2026 | Henger
From June 10–12, 2026, Henger Microelectronics made a powerful appearance at the JPCA SHOW in Tokyo — one of the world’s most influential exhibitions for the electronic circuit and advanced packaging industries.
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