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Advanced Electronics Packaging Digest

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Polar Instruments Addresses Signal Integrity Challenges With New Crosstalk and UHDI Application Notes

11/04/2026 | Polar Instruments
Polar Instruments has released two new application notes addressing important challenges in high-speed PCB design and fabrication: multi-line crosstalk and characteristic impedance correlation at ultra-high density interconnect (UHDI) dimensions.

ASC Sunstone Circuits to Showcase Advanced PCB Manufacturing Solutions at AEMS 2026

11/04/2026 | ASC Sunstone Circuits
ASC Sunstone Circuits announces that it will exhibit at the Anaheim Electronics & Manufacturing Show (AEMS) 2026, taking place November 10–11 at the Anaheim Convention Center in Anaheim, California.

HexaTech Announces 100 mm Diameter Aluminum Nitride Substrate Product

11/04/2026 | PRNewswire
HexaTech, Inc. announced the immediate production release of its new 100 mm diameter single crystal aluminum nitride (AlN) substrate product.

Arcline-Backed Signia Aerospace to Acquire Heads Up Technologies

11/04/2026 | PRNewswire
Signia Aerospace, a portfolio company of Arcline Investment Management, has entered into a definitive agreement to acquire Heads Up Technologies, a portfolio company of JLL Partners.

Samsung Electronics Acquires 10.16% Stake in TCL CSOT

11/04/2026 | PRNewswire
TCL Technology and Samsung Electronics Co., Ltd. (Samsung Electronics) jointly announced after market close on October 30 that Samsung Display Co., Ltd. (Samsung Display) will transfer its 10.16% stake in TCL China Star Optoelectronics Technology Co., Ltd. (TCL CSOT) to its parent company, Samsung Electronics, as part of efforts to strengthen strategic collaboration.
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