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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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NextNav, Safran Demonstrate 5G PNT Interoperability

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NextNav Inc., a leader in next-generation terrestrial Positioning, Navigation, and Timing (PNT) and 3D geolocation solutions, announced an agreement with Safran Electronics & Defense to integrate and demonstrate interoperability between NextNav's terrestrial 5G Positioning, Navigation, and Timing (PNT) network in Santa Clara County, California, and Safran’s timing and navigation receiver.

Qnity, University of Delaware Partner on Manufacturing Innovation

07/31/2026 | BUSINESS WIRE
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dSPACE Achieves CMMC Level 2 Certification

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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/31/2026 | Michelle Te, I-Connect007
When I first came to the electronics industry, I was coming from the outside. Over time, I learned that this is not an industry that can be understood from just one angle. What happens in design affects manufacturing. Material choices affect reliability. Supply chain decisions influence business strategy, and advances in technology create new challenges and opportunities throughout the entire ecosystem. That complexity is one of the things I appreciate most about covering this industry. Each week, I’m reminded that there is always another layer to explore.

Nordson Announces Leadership Transition in Investor Relations

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Nordson Corporation announced a leadership transition within its Investor Relations organization. Matthew Matejka has assumed responsibility for Investor Relations, succeeding Lara Mahoney, who has been appointed to a new role.
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