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Advanced Electronics Packaging Digest

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Knocking Down the Bone Pile: Hot Air vs. Infrared PCB Rework

08/31/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Component rework is the controlled process of removing, replacing, repositioning, or repairing electronic components on an assembled PCB. Rework may be required because of component defects, incorrect placement, soldering defects, engineering changes, or damage identified during inspection or testing. A successful rework process uses controlled heating, soldering, cleaning, handling, and inspection techniques to restore the assembly while minimizing thermal and mechanical stress to the PCB and surrounding components.

Javelin JV, Tata Advanced Systems Sign India Missile Co-Production Deal

08/31/2026 | Lockheed Martin
Tata Advanced Systems Limited and the Javelin Joint Venture (JJV), a partnership between Raytheon, an RTX business, and Lockheed Martin, have entered into a memorandum of understanding (MOU) for the co-production of the Javelin All Up Round (AUR) in India.

Radbon Electronics Achieves IPC/WHMA-A-620 QML Validation, Joins IPC Global Qualified Manufacturers List

08/31/2026 | Global Electronics Association
Radbon Electronics Co., Ltd. (Radbon Electronics) has passed the IPC/WHMA-A-620 Qualified Manufacturers List (QML) validation by the Global Electronics Association, earning its place on the IPC Global Qualified Manufacturers List.

Indium Expert to Present AI Packaging and High-Power Consumption Solutions at SEMICON Taiwan

08/31/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.

Infineon, Tack One Win SICC Award for Best Technological Collaboration

08/31/2026 | Infineon
Infineon Technologies Asia Pacific Pte Ltd and Tack One Pte Ltd have been recognized by Singapore International Chamber of Commerce (SICC)  as the winner of the “Best Technological Collaboration” category and as a finalist in the “Most Sustainable Collaboration” category at the 2026 SICC Awards ceremony, for their partnership in developing FloodFinder™, a smart urban flood monitoring system.
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