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Advanced Electronics Packaging Digest

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EMD Electronics Opens Wisconsin R&D Facility for Semiconductor Materials

10/02/2026 | Globe Newswire
EMD Electronics, the North America electronics business of Merck KGaA, Darmstadt, Germany, announced the opening of a new 38,000-square-foot research and development facility at its Sheboygan Falls, Wisconsin site, expanding the company’s ability to develop and scale advanced materials for next-generation semiconductor manufacturing.

DENSO Manufacturing Athens Tennessee Marks Months of Solar Energy Generation

10/01/2026 | PRNewswire
DENSO, a leading mobility supplier, is announcing the establishment and months of successful operation of a new solar energy facility at DENSO Manufacturing Athens Tennessee, Inc. (DMAT).

SK hynix Indiana Groundbreaking: Bringing Next-Generation AI Memory to the U.S.

09/30/2026 | SK hynix
SK hynix's recent groundbreaking ceremony in West Lafayette, Ind., marked a major milestone in development of the U.S. semiconductor supply chain. T

Tata Electronics, Enomoto Sign MoU to Strengthen India Semiconductor Packaging

09/24/2026 | Tata Electronics
Tata Electronics, a pioneering leader in India’s electronics and semiconductor manufacturing sector, and Enomoto Co., Ltd., a leading Japanese precision semiconductor component manufacturer, have signed a Memorandum of Understanding (MoU) to advance the semiconductor packaging ecosystem in India, and support Tata Electronics’ packaging facility in Jagiroad, Assam. 

TM Soldering Solutions Launches Selective Soldering Process Development Lab

09/22/2026 | TM Soldering Solutions
TM Soldering Solutions, the re-born successor to selective soldering pioneer ACE Production Technologies, announces the opening of a new Selective Soldering Process Development Lab in the company’s Spokane Valley production facility, it is announced.
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