Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
IPC Issues Call for Participation for IPC APEX EXPO 2026
June 2, 2025 | IPCEstimated reading time: 2 minutes
IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2026. The technical conference, reimagined and renamed to Advanced Electronic Packaging Conference 2026 Component- to System-Level Integration, will be held March 17-19 and professional development courses will take place March 15-16 and 19, 2026, at the Anaheim Convention Center in Anaheim, Calif.
“While the format and scope of the conference are being transformed, the core technical content our industry relies on is not only being preserved—it’s being expanded to better reflect today’s comprehensive component-to-system-level view,” said Stanton Rak, Ph.D., co-chair of the IPC APEX EXPO Technical Conference Program Committee. “We’re strongly encouraging technologists interested in presenting to provide an early indication of interest, by July 31. Doing so, could put prospective speakers in a lead position for session slots,” added Dr. Rak. Individuals can readily communicate their early indication of interest using the abstract submission portal.”
As the industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers, and executives from all segments of the industry worldwide. Topics for technical conference papers, technical posters and professional development courses include: design and simulation; materials; advanced PCB fabrication; assembly, test and manufacturing; quality, reliability and metrology; digital manufacturing; and sustainability.
Technical Conference and Poster Submissions
For technical conference paper presentations and posters, IPC seeks abstracts that describe significant results from research experiments, highlight new techniques or materials, and/or discuss cutting-edge trends and challenges facing the electronics manufacturing industry. All submissions must be non-commercial, summarizing original and previously unpublished work covering case histories, research, and discoveries. Papers will be published in a proceedings document, and both paper and poster presentations will be delivered in person at IPC APEX EXPO 2026 in Anaheim. Deadline for early indication of interest is July 31, 2025; with technical paper abstracts due September 12, 2025.
All posters will be displayed on the exhibit floor, with dedicated poster networking sessions for increased visibility. Authors of posters selected for the conference will receive further guidance on formatting, printing, and displaying posters. The deadline for technical poster abstracts is December 1, 2025.
To recognize exceptional achievement, the TPC will select the top qualifying papers and one top poster for awards. Awards include “Best of Conference,” “NextGen Best Paper,” “Best Student Research Paper,” and “Best Technical Poster.”
Professional Development Submissions
For professional development courses, IPC seeks abstracts for three-hour sessions of live instruction covering all aspects of electronics manufacturing. Courses can be offered as one 3-hour session or two 3-hour sessions (offered as Part 1 & Part 2 for a total of 6 hours). Honoraria and travel expense stipends are offered to professional development instructors. Professional development course abstracts are due September 19, 2025.
To submit an abstract, visit www.ipcapexexpo.org/event-info/call-participation. For more information on IPC APEX EXPO 2026, visit www.ipcapexexpo.org.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Peters, Starteam, and Würth Elektronik Team Up For Digital Coating Technology
10/23/2025 | PetersUnder this heading, the PCB manufacturers Starteam and Würth Elektronik, along with Peters as inkjet coating supplier, have taken the initiative and worked together for months in trusting and target-oriented cooperation, to promote this innovative digital coating technology for solder resists and establish it on the market.
Fuji America Promotes Chris Dayney to Technical Marketing Manager, Expanding Focus on Premium Technical Content
10/20/2025 | Fuji America CorporationFuji America Corporation is proud to announce the promotion of Chris Dayney to Technical Marketing Manager. Based in Crossville, Tennessee, Dayney has more than 30 years of SMT industry experience, including nearly three decades with Fuji America.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
The Marketing Minute: Marketing With Layers
10/15/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing to a technical audience is like crafting a multilayer board: Each layer serves a purpose, from the surface story to the buried detail that keeps everything connected. At I-Connect007, we’ve learned that the best marketing campaigns aren’t built linearly; they’re layered. A campaign might start with a highly technical resource, such as an in-depth article, a white paper, or a podcast featuring an engineer delving into the details of a process. That’s the foundation, the substance that earns credibility.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.