The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
When Small Just Isn’t Small Enough; INSPECTIS Launches Micro Size Optical Probe Tip for BGA Inspection
June 3, 2025 | INSPECTISEstimated reading time: 1 minute
The Inspectis BGA inspection system now offers the tiniest optical probe, the Micro Size Optical Probe Tip, for users who feel that they need to get ‘really small’. As BGA packages and their standoffs continue to shrink, viewing under them becomes ever more difficult, making accurate and comprehensive inspection extremely challenging. The Micro Size Optical Probe Tip, however, works like an inverted periscope, viewing the underside of tiny components at a 90-degree angle with an optical probe tip footprint of only 0.4 x 3.5 mm and a width of only 3.5mm.
“The Inspectis BGA inspection system now features the tiniest optical probe with high-resolution optics,” said Alistair Gooch, Marketing Manager. “With its built-in LED lighting, 5.0-megapixel image sensor and high-power background illumination, the Inspectis BGA Inspection System, equipped with the Micro Size Optical Probe Tip, produces high-resolution images of the extremely low-clearance areas beneath BGAs and other tiny packages with as low as 40 microns stand-off.”
Ergonomically designed, the unit is mounted on a compact yet robust stand with an X-Y translation stage for maximum flexibility and configurability. The unique side-view BGA Inspection system features the tiniest and most robust optical probe available with built-in high-power lighting and a crisp, sharp high-resolution 90-degree viewing angle.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Haylo Labs Acquires Plessey Semiconductors
08/20/2025 | Haylo LabsHaylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.
Coherent Announces Agreement to Sell Aerospace and Defense Business to Advent for $400 Million
08/15/2025 | AdventCoherent Corp., a global leader in photonics, today announced that it has entered into a definitive agreement to sell its Aerospace and Defense business to Advent, a leading global private equity investor, for $400 million. Proceeds will be used to reduce debt, which will be immediately accretive to Coherent’s EPS.
OKI Develops Tiling Crystal Film Bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
08/15/2025 | BUSINESS WIREOKI has successfully developed Tiling crystal film bonding technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of small-diameter optical semiconductor wafers onto 300 mm silicon wafers, heretofore not possible due to wafer size restrictions, and will contribute to the advancement of rapidly growing photonics-electronics convergence technology.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.