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Indium Joins Virginia Tech Center for Power Electronics Systems Industry Consortium
June 3, 2025 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, has joined Virginia Tech’s Center for Power Electronics Systems (CPES), an industry consortium that supports power electronics initiatives to reduce energy use while growing capability.
CPES is dedicated to improving electrical power processing and distribution that impact systems of all sizes, from battery-operated electronics and vehicles to regional and national electrical distribution systems. The organization has a worldwide reputation for its research advances, its work with industry to improve the entire field, and its many talented graduates.
With a specific focus on power device packaging, Indium Corporation continues to advance its portfolio of die-attach, package-attach, and thermal interface materials (TIMs) solutions that are custom-engineered to satisfy the mission profile demands for power electronics applications.
“Advancing materials technology is a key enabler to realize our design goals for power electronics,” said Ryan Mayberry, Senior Application Development Engineer at Indium Corporation. “Through collaboration with CPES, Indium Corporation will leverage innovations in materials science and align research and development initiatives to address future power device requirements.”
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04/16/2026 | Alpha and Omega Semiconductor LimitedAlpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots
04/15/2026 | PRNewswireHYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.
Koh Young Highlighting its Smart AI Solutions at the SMTA Monterrey Expo and Tech Forum
04/15/2026 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will exhibit at the upcoming SMTA Monterrey Expo & Tech Forum on Thursday, April 23, 2026, at Cintermex, located at Av. Fundidora 501, Colonia Obrera, Monterrey, Nuevo León, Mexico.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.