Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Siris to Acquire 19.1% Stake in Agfa-Gevaert from Active Ownership

09/28/2026 | Agfa-Gevaert
Agfa-Gevaert NV announced that Siris Capital Group has signed a strategic investment in Agfa-Gevaert NV to acquire a 19.1% stake currently held by Active Ownership. Terms of the transaction were not disclosed.

Technica USA Joins Supply Partner Agfa at TechBlick 2026

06/11/2026 | Technica USA
Technica USA and Agfa showcased Orgacon® and Agfa’s portfolio of conductive materials at the 2026 TechBlick Conference & Exhibition, held this week at the Computer History Museum in Mountain View, California.

Paul Owsianowski Joins Board of Directors Agfa-Gevaert NV

12/10/2025 | Agfa-Gevaert
The Board of Directors of Agfa-Gevaert NV announced that, during its meeting of December 9, 2025, it has co-opted Paul Owsianowski (AOC) as a non-executive director.

Technica Expands into Emerging Printed Electronics and Advanced Coatings Markets

06/04/2025 | Technica USA
Technica is expanding its product portfolio with Agfa’s advanced line of Orgacon conductive coatings. The Orgacon products are a natural complement to Technica’s existing solutions and will allow the company to deliver greater value to customers in these markets.

Fiona Lam Appointed as CFO for the Agfa-Gevaert Group

10/21/2024 | Agfa-Gevaert
Fiona Lam joins the Agfa-Gevaert Group as Chief Financial Officer and member of the Executive Committee. Current CFO Dirk De Man has decided to take a step back due to health reasons.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in