Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
Beyond Design: The Metamorphosis of the PCB Router
IPC Releases Latest Standards and Revisions Updates
June 5, 2025 | IPCEstimated reading time: 1 minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q2 2025.
IPC-1602A
Standard for Printed Board Handling and Storage
The industry's sole standard on the handling, packaging, and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, solderability degradation, ESD, and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling, and transport of product, as well as establishing baking profiles for moisture removal. This document addresses the impact of baking on printed board solderability, moisture concerns for etched cores and composites, dry packaging requirements including moisture barrier bags (MBBs), desiccant material and HIC cards, test coupons for evaluating relative moisture absorption and guidance for floor life and rework by baking.
IPC-7095E
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair, and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095E provides valuable and practical information to those who use or are considering using BGAs. IPC-7095E provides descriptions of how to successfully implement robust design and assembly processes for printed board assemblies using BGAs, as well as ways to troubleshoot some common anomalies that can occur during BGA assembly.
IPC-8401
Guidelines for In-Mold Electronics
IPC-8401 provides guidelines for in-mold electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-mold electronics integrate printed electronics and electrical components into injection-molded plastics, creating a three-dimensional smart molded structure. IME technology uses mass production processes, materials, and components. IME parts are structural electronics characterized by their light weight, thinness, robustness, and seamless integration.
Get the rest of the updates in the Spring 2025 issue of IPC Community.
Share on:
Suggested Items
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
Summit Interconnect Participates in PCBAA Annual Meeting to Advance U.S. Electronics Policy
06/26/2025 | Summit Interconnect, Inc.Summit Interconnect was proud to participate in the 2025 Annual Meeting of the Printed Circuit Board Association of America (PCBAA), held in Washington, D.C. this June.
North American PCB Industry Sales Up 21.4% in May
06/20/2025 | IPCIPC announced the May 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.03.
All Flex Solutions Upgrades Lamination Layup
06/22/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
'Air Sovereignty' for AT&S: Gold Status Underpins Highest Aerospace Competence in Leoben
06/19/2025 | AT&SThe systems that control modern aircraft are subject to the strictest requirements in the electronics industry. Suppliers to aviation companies must therefore have their production facilities and processes inspected annually by independent auditors as part of the National Aerospace and Defense Contractors Accreditation Program (Nadcap).