Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
IPC Releases Latest Standards and Revisions Updates
June 5, 2025 | IPCEstimated reading time: 1 minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q2 2025.
IPC-1602A
Standard for Printed Board Handling and Storage
The industry's sole standard on the handling, packaging, and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, solderability degradation, ESD, and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling, and transport of product, as well as establishing baking profiles for moisture removal. This document addresses the impact of baking on printed board solderability, moisture concerns for etched cores and composites, dry packaging requirements including moisture barrier bags (MBBs), desiccant material and HIC cards, test coupons for evaluating relative moisture absorption and guidance for floor life and rework by baking.
IPC-7095E
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair, and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095E provides valuable and practical information to those who use or are considering using BGAs. IPC-7095E provides descriptions of how to successfully implement robust design and assembly processes for printed board assemblies using BGAs, as well as ways to troubleshoot some common anomalies that can occur during BGA assembly.
IPC-8401
Guidelines for In-Mold Electronics
IPC-8401 provides guidelines for in-mold electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-mold electronics integrate printed electronics and electrical components into injection-molded plastics, creating a three-dimensional smart molded structure. IME technology uses mass production processes, materials, and components. IME parts are structural electronics characterized by their light weight, thinness, robustness, and seamless integration.
Get the rest of the updates in the Spring 2025 issue of IPC Community.
Share on:
Suggested Items
Growing Demand for Mid-Size Displays Opens New Opportunities for FMM-Free OLED Technologies
06/05/2025 | TrendForceTrendForce’s latest report on the display industry reveals that OLED technology—valued for its self-emissive structure, high contrast ratio, and lightweight design—continues to expand its market presence, primarily in small-size applications such as smartphones.
MKS’ Atotech, ESI Showcase Next-gen PCB and Advanced Packaging Solutions at JPCA 2025
06/04/2025 | MKS’ AtotechMKS, through its leading surface finishing brand Atotech® and laser system brand ESI®, proudly announces its participation at the 2025 JPCA Show in Tokyo, Japan, from June 4–6. At booth 6D-01, the company will highlight the combined power of its strategic brands Atotech® and ESI®, showcasing the latest innovations in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing.
NCAB Closes Acquisition of B&B Leiterplattenservice GmbH in Germany
06/04/2025 | NCABAs was communicated on April 23 NCAB has signed an agreement to acquire 100 percent of B&B Leiterplattenservice GmbH (B&B) headquartered in Mittweida, Germany. Today, the 3 of June the acquisition is closed, and the company now is part of the NCAB Group.
DuPont Powers AI, Next-Gen Electronics with Advanced Interconnect Innovations at JPCA Show 2025
06/04/2025 | PRNewswireDuPont announced its participation in the Total Solution Exhibition for Electronic Equipment 2025 (JPCA Show 2025), taking place from June 4-6 at the Tokyo Big Sight East Exhibition Halls. At Booth #6C-03,
Agfa Announce Strategic Partnership with Technica for US Orgacon Distribution
06/03/2025 | AgfaAgfa, a leading supplier of conductive materials for the printed electronics sector, is pleased to announce a new partnership with Technica USA as the distributor for its Orgacon range of printed electronics products across the United States.