MKS’ Atotech, ESI Showcase Next-gen PCB and Advanced Packaging Solutions at JPCA 2025

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MKS, through its leading surface finishing brand Atotech® and laser system brand ESI®, proudly announces its participation at the 2025 JPCA Show in Tokyo, Japan, from June 4–6. At booth 6D-01, the company will highlight the combined power of its strategic brands Atotech® and ESI®, showcasing the latest innovations in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing.

Visitors will experience MKS’ full suite of advanced solutions—including next-generation chemical processes, production systems, auxiliary equipment, precision laser technologies, and software solution—all engineered to improve yield, reliability, and manufacturing efficiency in the electronics industry.

As AI and high-performance computing (HPC) continue to drive demand for faster, more compact electronics, MKS is at the forefront of innovation. Its technologies support miniaturization, signal integrity, and scalability, essential for enabling next-gen interconnect architectures.

MKS’ approach – Optimize the InterconnectSM – unites its deep expertise in lasers, optics, motion, chemistry, and plating systems, delivering integrated solutions that address the challenges of modern electronics production. The combination of ESI’s industry-leading laser drilling with Atotech’s proven chemistry and plating systems positions MKS as a key enabler of finer features and advanced interconnect designs.

Toshiya Fujiwara, Business Manager Electronics at MKS Atotech, commented: “We are proud to offer a complete solution that integrates cutting-edge chemistry, equipment, and laser technology. Combined with local technical support, we’re committed to helping our customers achieve excellence in advanced electronics manufacturing.”

This year’s chemical process highlights include:

• Printoganth® MV TP3: Advanced electroless copper bath designed to provide a uniform
• 100-150 nm copper deposit on IC substrates with excellent adhesion to low roughness dielectrics and reliable bottom-up recrystallization
• InPro® SAP3: Advanced BMV filling process that offers excellent copper uniformity and stable production at high current densities for VCP systems with insoluble anodes
• NovaBond® EX-S2: Adhesion Promoter for the latest ABFs with zero-line width reduction and minimized surface nano-roughness, very suitable for ultra-fine lines and high frequency applications due to its nearly impeccable signal integrity
• Stanna®-Flex Tin finish for flexible substrates offering mild plating properties, high material compatibility, and excellent fine line performance

Equipment highlights are:

• G-Plate®: Vertical desmear and electroless HVM plating tool for nextgen high-end package substrates with optimized particle control
• CapstoneTM: flex PCB UV drilling tool for high-performance breakthrough productivity
• 5335™ flex PCB laser drill: Best-in-class high-volume FPC laser drilling machine for flexible PCB manufacturing
• Geode™ platform solutions: Next generation PCB and advanced substrate CO2 and UV laser via drills

Conference: JPCA Show 2025
Date:: June 4-6, 2025
Booth: 6D-01
Venue: Tokyo Big Sight (East Exhibition Halls)