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Advanced Electronics Packaging Digest

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SEMI, 23 Member Companies Urge U.S. Congress to Extend Advanced Manufacturing Investment Credit

05/18/2026 | SEMI
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, and 23 member companies on the SEMI Tax Policy Committee, issued a letter to the U.S. Congress urging immediate passage of a multi-year extension of the Advanced Manufacturing Investment Credit (AMIC).

Powering the Future: Why True Ceramic Circuits Are Not Just ‘Better PCBs’

05/20/2026 | Brian Buyea -- Column: Powering the Future
There’s a dangerous misconception among engineers who still think ceramic circuits are just a little tougher version of a PCB, a little better at handling heat, and a premium option when FR-4 starts to struggle. That thinking will cost you performance and reliability; in some applications, it may cost you the entire design. Remtec builds are not “better PCBs,” but fundamentally different platforms. Here are eight “truths” to demonstrate that difference.

Top Business Groups Urge Congress to Extend, Expand Successful Semiconductor Tax Credit

05/14/2026 | SIA
The Semiconductor Industry Association (SIA) and a broad coalition of 17 other top business and trade groups in a letter urged Congress to extend the Advanced Manufacturing Investment Credit (AMIC) – a highly impactful tax credit for chip production that is set to expire at the end of this year – and expand it to cover semiconductor design and other critical R&D activities.

Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance

05/20/2026 | Chandra Gupta -- Column: Below the Surface
If you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.

IBM, Dallara to Advance AI and Quantum-Powered Design for High-Performance Vehicles

05/01/2026 | IBM
IBM and the Dallara Group, a world-leading racing and high-performance vehicle manufacturer, announced a collaboration to advance vehicle design and optimization using AI and explore the use of quantum computing.
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