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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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High-Frequency High-Speed CCL Market to Reach $3.1B by 2035

08/13/2026 | Globe Newswire
The global high frequency high speed copper clad laminate market was valued at $4.5 billion in 2025 and is estimated to grow at a CAGR of 10.3% to reach $11.8 billion by 2035.

A Practical Approach to Material Selection for High Power PCBs

08/17/2026 | Drew Delaney, Isola Group
With AI server architectures demanding high-power converter solutions to improve power efficiency and affordability, PCB design can challenge engineers who treat material selection as a single-variable problem. Pick a laminate for thermal conductivity, and you may experience a CTE mismatch that cracks vias after 50 thermal cycles. Optimize for dielectric loss, and you might sacrifice the isolation margin your certification depends on. High-power boards require consideration of multiple variables, including electrical, thermal, mechanical, reliability, and manufacturability, which cannot be optimized alone.

The Spirit of Giving Never Ends at Kimball Electronics Thailand

08/05/2026 | Kimball Electronics
Supporting our communities is an important part of creating quality for life, and the team at Kimball Electronics Thailand recently demonstrated that commitment through a generous employee donation initiative.

Remtec to Participate at PCB West 2026, Showcasing Advanced Ceramic PCB Technologies for High-Reliability Electronics

08/04/2026 | Remtec
Remtec President & CEO Brian Buyea invites Engineers, Designers and OEMs to discover the future of advanced ceramic circuit solutions.

Extropic Signs $75M LOI with U.S. Commerce Department

08/03/2026 | PRNewswire
Extropic, the American company pioneering thermodynamic computing hardware, announced the signing of a letter of intent with the U.S. Department of Commerce for up to $75 million in funding through the CHIPS Research and Development Office (CRDO).
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