-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Orbel Corporation Integrates Schmoll Direct Imaging
June 4, 2025 | Schmoll AmericaEstimated reading time: 2 minutes
Orbel Corporation in Easton, PA, proudly becomes the first PCM facility in the U.S. equipped with Schmoll’s MDI Direct Imaging system. This installation empowers Orbel to support customers with greater precision and quality.
Key benefits include:
- Compact Design: Easily replaces older units without increasing cleanroom footprint.
- Granite Stability: Ensures precision for high-accuracy demands.
- Automation: Reduces operator inputs and maximizes efficiency.
- Advanced Imaging: Automatic target recognition, even on challenging surfaces (RGB+IR Combi Ringlight).
- Superior Alignment: UV-Marker system for precise front-to-back alignment.
- Optimal Etch Quality: High-res photohead for straight sidewall profiles, tuned to specific photoresist.
"The MDI Direct Imaging system from Schmoll has made a real impact on our production capabilities. We’re seeing faster turnarounds and more consistent results across the board. From design input to the final printed image, everything moves quicker and more smoothly. The automatic alignment feature has noticeably enhanced our accuracy, and being able to serialize each product adds both value and enhancing traceability to our workflow," shared members of the Orbel team. " The system also gives us detailed production logs, which have improved how we monitor and manage our operations. Most importantly, we’re seeing more uniform, repeatable quality—which means higher yields and greater overall efficiency."
They went on to state, "What stood out to us right away was the improved image quality. The level of detail and consistency we can now achieve is simply on another level. This has had a noticeable impact on our end product, especially in applications requiring tight tolerances and sharp feature definition."
The Schmoll MDI system utilizes advanced photohead technology, combining a powerful UV-LED light source with a DMD (Digital Micromirror Device) chip to generate high-resolution images.
The DMD chip itself consists of millions of micromirrors whose precise orientation controls the direction of the UV light, effectively shaping the projected image. This technology enables the transfer of intricate design features onto photosensitive resist materials.
To ensure the stability and definition of these imaged features, the system allows for adjustment of the needed wavelength ratio used during exposure. Operating across multiple UV wavelengths, the MDI system can be finely tuned to accommodate a wide range of photoresists and substrate materials. This broad compatibility makes it a highly versatile and flexible imaging solution for diverse manufacturing requirements.
The team commented, “Having this kind of imaging power on the production floor gives us more confidence in what we deliver. It’s not just about meeting specs, it’s about exceeding expectations."
The Schmoll and Orbel partnership is a strong example of how modern manufacturing technology, backed by effective collaboration and expertise, can drive real progress.
From the initial conversations to the final installation, the partnership between Orbel, Schmoll America, and Schmoll Maschinen Germany was built on open communication, trust and a shared vision for innovation. Each team brought its own strengths to the table, localized support and responsiveness from Schmoll America, deep technical know-how from Germany, and Orbel’s forward-thinking approach to adopting advanced technology.
By working closely together at every stage, from sample testing to operator training, we ensured a smooth implementation of direct imaging technology. The result: faster ramp-up, minimized downtime, and a system running at full potential from day one.
This collaboration reflects what’s possible when the right partners come together with a common goal: pushing manufacturing forward through smart, connected solutions.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Kymeta Joins Red Cat Initiative for Maritime Connectivity
05/15/2026 | Globe NewswireRed Cat Holdings, Inc. , a U.S.-based provider of advanced all-domain drone and robotic solutions for defense and national security, announced that Kymeta, a world-leading flat-panel satellite terminal manufacturer, has joined the Red Cat Futures Initiative, the company’s industry-wide consortium accelerating advanced autonomous systems for modern warfare.
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
System Architecture Beyond the Die With Advanced Packaging as the Scaling Factor
05/14/2026 | Chetan Arvind Patil, Marvell TechnologyIn conventional monolithic semiconductor design, system integration was achieved within a single die and constrained by reticle limits. Compute cores, cache, memory controllers, and input output (I/O) interfaces were all co-optimized on a single process node, with performance closely tied to transistor density and on-die interconnect efficiency. This monolithic system-on-chip (SoC) approach enabled low-latency communication and relatively straightforward power delivery. However, as design for compute-intensive SoCs approaches reticle limits and advanced-node costs increase, the ability to continue scaling within a single die begins to diminish.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance
05/14/2026 | Chandra Gupta -- Column: Below the SurfaceIf you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.