Dan’s Biz Bookshelf ‘House of Huawei'
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
Facing the Future: Challenges and Opportunities in Reshoring PCB Manufacturing
GEN3 Set to Host HATS²™ Technical Day at A.W. Technical Centre with Bob Neves
June 9, 2025 | Gen3Estimated reading time: 1 minute
GEN3, a global leader in reliability testing and measurement solutions for the electronics industry, is excited to announce a dedicated HATS²™ Technical Day to be held at the A.W. Technical Centre in Farnborough, GEN3’s HQ. The event will showcase the HATS²™ (Highly Accelerated Thermal Shock) system with demos and presentations by Bob Neves, Chairman of RAS Inc. and creator of the HATS²™.
The event will invite Electronics Manufacturers to the A.W Technical Centre where attendees will benefit from a unique opportunity to learn directly from Bob Neves, who will present the evolution of HATS²™, and with GEN3 provide live demonstrations of the HATS²™. The day will offer in-depth insights into the HATS²™ features and functionality, and the multi-test capabilities of the revolutionary piece of kit.
About HATS²™
- Thermal Cycling at Speed: Capable of delivering up to 1000 convection-based temperature cycles per week, with transitions between –65 °C to +265 °C, enabled by high-speed air transfer – eliminating the need for liquid nitrogen or oil-based systems.
- Real-Time Failure Detection: The integrated 4-wire resistance measurement tracks interconnect integrity during thermal cycling, supporting IPC-2221B and custom coupons with up to 252 nets.
- Reflow Assembly Simulation: Fully programmable to mimic real-world reflow oven conditions per IPC-TM-650 Method 2.6.27B, the system supports unlimited cycle profiles and captures data-rich outputs including detailed box plots.
Event Highlights
- Live HATS²™ system demonstrations.
- In-person technical presentation by Bob Neves, RAS Inc.
- Q&A session with Bob & GEN3 reliability experts.
- Hands-on exploration of test profiling, chamber setup, and data interpretation.
Event Details
Location: GEN3 A.W. Technical Centre, Farnborough, UK
Date: September 2025
“We are excited to welcome Bob back to GEN3 HQ for this this unique opportunity to share the HATS²™ with engineers, board manufacturers, quality managers, and researchers to exploring it’s capabilities and to learn directly from the mind behind HATS™” said Andy Naisbitt, CEO of GEN3.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
It’s Only Common Sense: Stop Chasing New Customers and Start Keeping the Ones You Have
08/11/2025 | Dan Beaulieu -- Column: It's Only Common SenseCustomer retention is not glamorous. It doesn’t have a flashy ad campaign, it’s not going viral on social media, and nobody’s handing out “Best in Retention” awards at trade shows. However, if you’re running a proper business, not a popularity contest, then customer retention is where you make your money. However, too many companies treat customer retention as an afterthought.
Register Now for the HATS²™ Technical Day at GEN3 HQ
08/05/2025 | GEN3GEN3 a world-leading manufacturer of testing, measurement and production solutions for electronics reliability. Headquartered in Farnborough, UK, GEN3 is announcing the final call for registrations to attend the exclusive HATS²™ Technical Day — a hands-on, live demonstration event showcasing the Highly Accelerated Thermal Shock Tester (HATS²™), the groundbreaking innovation from industry pioneer Bob Neves.
Global PCB Connections: Let the Spec Fit the Board, Not Just the Brand
07/17/2025 | Markus Voeltz -- Column: Global PCB ConnectionsIf you’ve ever seen an excellent PCB quote delayed, or worse, go cold because of a single line on the fab print, you’re not alone. Often, that line reads something like, “Use 370HR only,” or “IT-180A required.” These and other brand-name materials are proven performers, but unless your design needs that specific resin system (say, for RF performance, thermal reliability, or stringent CAF resistance), you may inadvertently be holding your job hostage.
IPC Hall of Fame Spotlight Series: Highlighting Bob Neves
06/11/2025 | Dan Feinberg, I-Connect007Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. This Hall of Fame spotlight features industry veteran Bob Neves, who joined IPC in 1986 and was inducted into the IPC Hall of Fame in 2007.
Innovative Technology Advancements in Test: HATS² Technology and Its Impact on Reliability Testing
05/14/2025 | Barry Matties, I-Connect007Ensuring the reliability of printed circuit boards (PCBs) has become increasingly difficult and critical, yet the development of advanced testing methodologies is essential to meeting industry demands and addressing persistent challenges. One significant innovation is the High Acceleration Thermal Shock (HATS²) test system, which transforms how reliability testing is conducted. After 40 years in the testing business at Microtek, Bob Neves is beginning a new journey with his company, Reliability Assessment Solutions Inc. (RAS).