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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones
June 9, 2025 | BUSINESS WIREEstimated reading time: 1 minute
VeriSilicon recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer’s mass-produced smartphones, reaffirming the company’s comprehensive one-stop custom silicon service capabilities in AI vision processing.
VeriSilicon’s AI-ISP custom chip solution can integrate proprietary or third-party Neural Network Processing Unit (NPU) IP and Image Signal Processing (ISP) IP. By combining traditional image processing techniques with AI algorithms, it significantly enhances image and video clarity, dynamic range, and environmental adaptability. The chip solution offers flexible configurations with RISC-V or Arm-based processors, supports MIPI image input/output interfaces, provides LPDDR5/4X memory integration capability, and is compatible with common peripheral interfaces such as UART, I2C, and SDIO. This makes the solution highly adaptable for deployment across various applications including smartphones, surveillance systems, and automotive electronics.
For this collaboration, VeriSilicon designed a low-power AI-ISP system-on-chip (SoC) based on the RISC-V architecture, tailored to the customer’s specific requirements. It also included a FreeRTOS real-time Software Development Kit (SDK). The customized SoC was fully optimized for seamless interoperability with the customer’s main processor platform and has since been successfully deployed in multiple smart devices, achieving large-scale production. This success highlights VeriSilicon’s robust capabilities in heterogeneous computing, software-hardware co-optimization, and system-level integration and verification.
“AI-powered imaging has become a key differentiator in the competitive smartphone market, driving increasing demand for high-performance and low-power image processing solutions,” said Wiseway Wang, Executive Vice President and General Manager of the Custom Silicon Platform Division at VeriSilicon. “With full-spectrum capabilities ranging from IP licensing and chip architecture design to system-level software and hardware development, tape-out, packaging and testing, as well as mass production, VeriSilicon offers end-to-end custom silicon services leveraging its extensive design service experience and proven mass production capabilities. The successful mass production of this customer’s chip further validates our strength in high-end silicon design services. Moving forward, we will continue to innovate and improve our offerings, empowering customers to accelerate the launch of differentiated products with efficient, high-quality custom chip solutions.”
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Microchip Earns IEC 62443-4-1 ML2 Industrial Automation and Control System Certification
04/08/2026 | MicrochipAs connected systems spread across residential, industrial and commercial environments, the need for independently verified cybersecurity assurance is becoming a core requirement.
Boston Micro Fabrication Introduces BMF Clear, Enabling Scalable Optical Microfabrication
04/07/2026 | Boston Micro FabricationBoston Micro Fabrication (BMF), the global leader in micro-precision 3D printing, announces the launch of the BMF Clear, an optically transparent photopolymer resin engineered for applications requiring exceptional light transmission and micron-level accuracy, such as microfluidics, photonics, advanced optical components, biomedical devices and more.
Global Semiconductor Sales Increase Substantially in February
04/06/2026 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales were $88.8 billion during the month of February 2026, an increase of 7.6% compared to the January 2026 total of $82.5 billion and 61.8% more than the February 2025 total of $54.9 billion.
Nanya Technology Secures $2.5 Billion to Expand Advanced Memory Production Amid AI-Driven Shortage
04/02/2026 | I-Connect007 Editorial TeamTaiwanese memory chipmaker Nanya Technology saw its shares jump to the daily limit of 10% following the announcement of a $2.5 billion private placement from investors SanDisk, HK Hynix, Cisco Systems and Kioxia, aimed at boosting its advanced chip manufacturing capacity.
SEMI Europe Applauds EU Chips Act 2.0 Implementation Dialogue
03/26/2026 | SEMISEMI Europe participated in the European Commission’s Implementation Dialogue on the Chips Act, chaired by Henna Virkkunen, Executive Vice-President of the European Commission for Tech Sovereignty, Security and Democracy.