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VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones
June 9, 2025 | BUSINESS WIREEstimated reading time: 1 minute
VeriSilicon recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer’s mass-produced smartphones, reaffirming the company’s comprehensive one-stop custom silicon service capabilities in AI vision processing.
VeriSilicon’s AI-ISP custom chip solution can integrate proprietary or third-party Neural Network Processing Unit (NPU) IP and Image Signal Processing (ISP) IP. By combining traditional image processing techniques with AI algorithms, it significantly enhances image and video clarity, dynamic range, and environmental adaptability. The chip solution offers flexible configurations with RISC-V or Arm-based processors, supports MIPI image input/output interfaces, provides LPDDR5/4X memory integration capability, and is compatible with common peripheral interfaces such as UART, I2C, and SDIO. This makes the solution highly adaptable for deployment across various applications including smartphones, surveillance systems, and automotive electronics.
For this collaboration, VeriSilicon designed a low-power AI-ISP system-on-chip (SoC) based on the RISC-V architecture, tailored to the customer’s specific requirements. It also included a FreeRTOS real-time Software Development Kit (SDK). The customized SoC was fully optimized for seamless interoperability with the customer’s main processor platform and has since been successfully deployed in multiple smart devices, achieving large-scale production. This success highlights VeriSilicon’s robust capabilities in heterogeneous computing, software-hardware co-optimization, and system-level integration and verification.
“AI-powered imaging has become a key differentiator in the competitive smartphone market, driving increasing demand for high-performance and low-power image processing solutions,” said Wiseway Wang, Executive Vice President and General Manager of the Custom Silicon Platform Division at VeriSilicon. “With full-spectrum capabilities ranging from IP licensing and chip architecture design to system-level software and hardware development, tape-out, packaging and testing, as well as mass production, VeriSilicon offers end-to-end custom silicon services leveraging its extensive design service experience and proven mass production capabilities. The successful mass production of this customer’s chip further validates our strength in high-end silicon design services. Moving forward, we will continue to innovate and improve our offerings, empowering customers to accelerate the launch of differentiated products with efficient, high-quality custom chip solutions.”
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Trump Renegotiating Biden-era Chips Act Grants
06/09/2025 | I-Connect007At a hearing on June 4, U.S. Commerce Secretary Howard Lutnick said the Trump administration is renegotiating several of former President Joe Biden’s U.S. CHIPS and Science Act grants to semiconductor firms, Reuters reported.
GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth
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Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025
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Insights Into a Differentiating Trade/Investment Global Strategy for Electronics
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/23/2025 | Marcy LaRont, I-Connect007In the electronics manufacturing industry, the global PCB market is estimated to reach $86.5 billion by 2029, a 5.9% annual growth, per IPC’s Global Market Forecast, and the global new cycle is still being dominated by U.S. news. This week, we are talking about the status of the CHIPS Act and what the new tax and incentives bill does and does not include. We also take a minute for some marketing wisdom to shed light in a challenging and noisy market environment.