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POLYN Technology Announces Tapeout of Automotive Chip

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POLYN Technology, a leader in neuromorphic technology with application-specific Neuromorphic Analog Signal Processing (NASP) products, has taped out a VibroSense™ engineering chip featuring an analog neuromorphic core for tire friction monitoring.

AI Competition Turns into a Supply Chain Arms Race, Tightening Advanced Packaging and 3nm Capacity

04/30/2026 | TrendForce
TrendForce’s latest foundry industry findings point out that AI demand has surged rapidly since 2023, leading to capacity bottlenecks in 3 nm–2 nm wafers and 2.5D/3D advanced packaging.

EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space

04/28/2026 | ECIO
Every chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?

SEMI Europe Outlines Six Key Recommendations to Strengthen Chips Act 2.0

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Global Direct-to-Cell Market to Grow 49% YoY in 2026, Unlocking New Supply Chain Opportunities

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Direct-to-Cell technology is rapidly maturing as global mobile communications standards 3GPP Release 17 and Release 18 continue to incorporate satellite communications.
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