-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Mercedes-Benz Shapes Future of Autonomous Computing as Co-Creator of Next-Generation Chip Standards with Athos Silicon
October 9, 2025 | Mercedes-BenzEstimated reading time: 1 minute
Mercedes-Benz announced a reference design collaboration with Athos Silicon, a specialized semiconductor company established by former engineers at Mercedes-Benz Research & Development North America, Inc. (MBRDNA). This partnership accelerates the adoption and scaling of advanced chiplet architecture originally researched at MBRDNA while supporting next-generation autonomous driving platforms across the industry. The initiative underscores Mercedes-Benz’s leadership in Silicon Valley innovation and strategic ecosystem development.
Mercedes-Benz’s forward-thinking strategy began with pioneering R&D efforts starting in 2020 at MBRDNA, where teams developed breakthrough chiplet technology for autonomous driving computing. Recognizing the technology’s broad applications beyond automotive use cases, Mercedes-Benz facilitated the formation of Athos Silicon as an independent entity to maximize the innovation’s industry impact. Mercedes-Benz contributes substantial intellectual property while enabling the technology to scale with dedicated capital from broader ecosystem partnerships. Athos Silicon’s modular mSoC™ platform delivers adaptable performance scaling, accelerated development cycles, and safety-by-design principles that position Mercedes-Benz at the forefront of the autonomous computing revolution.
“Mercedes-Benz continuously explores technologies that can advance safety, performance and automated driving. Open chiplet approaches—such as UCIe—show promise for future high-performance compute architectures. Athos Silicon, an independent company with roots in research initiated at Mercedes-Benz in 2020, will pursue its own path to develop these ideas for broader industry use.”
Markus Schäfer, Member of the Board of Management of Mercedes-Benz Group AG, Chief Technology Officer.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BYD Set to Challenge Tesla for the Crown in EV Sales in 2024
02/20/2024 | BUSINESS WIRETrendForce reports that global sales of NEVs, including BEVs, PHEVs, and FCVs, reached 13.03 million units in 2023—marking a growth rate of 29.8%. This represents a significant slowdown from the 54.2% growth rate in 2022.
Mercedes-Benz and NVIDIA to Build Software for Automated Driving Across Future Fleet
06/23/2020 | NVIDIA NewsroomMercedes-Benz, one of the largest manufacturers of premium passenger cars, and NVIDIA, the global leader in accelerated computing, plan to enter a cooperation to create a revolutionary in-vehicle computing system and AI computing infrastructure. Starting in 2024, this will be rolled out across the fleet of next-generation Mercedes-Benz vehicles, enabling them with upgradable automated driving functions.
Geely, Mercedes-Benz Launch $780 Million JV to Make Electric Smart-Branded Cars
01/09/2020 | ReutersZhejiang Geely Holding Group Co Ltd and Mercedes-Benz on Wednesday said they would each invest 2.7 billion yuan ($388.77 million) in a China-based venture to build “premium and intelligent electrified” vehicles under the smart brand.