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VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones
June 9, 2025 | BUSINESS WIREEstimated reading time: 1 minute
VeriSilicon recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer’s mass-produced smartphones, reaffirming the company’s comprehensive one-stop custom silicon service capabilities in AI vision processing.
VeriSilicon’s AI-ISP custom chip solution can integrate proprietary or third-party Neural Network Processing Unit (NPU) IP and Image Signal Processing (ISP) IP. By combining traditional image processing techniques with AI algorithms, it significantly enhances image and video clarity, dynamic range, and environmental adaptability. The chip solution offers flexible configurations with RISC-V or Arm-based processors, supports MIPI image input/output interfaces, provides LPDDR5/4X memory integration capability, and is compatible with common peripheral interfaces such as UART, I2C, and SDIO. This makes the solution highly adaptable for deployment across various applications including smartphones, surveillance systems, and automotive electronics.
For this collaboration, VeriSilicon designed a low-power AI-ISP system-on-chip (SoC) based on the RISC-V architecture, tailored to the customer’s specific requirements. It also included a FreeRTOS real-time Software Development Kit (SDK). The customized SoC was fully optimized for seamless interoperability with the customer’s main processor platform and has since been successfully deployed in multiple smart devices, achieving large-scale production. This success highlights VeriSilicon’s robust capabilities in heterogeneous computing, software-hardware co-optimization, and system-level integration and verification.
“AI-powered imaging has become a key differentiator in the competitive smartphone market, driving increasing demand for high-performance and low-power image processing solutions,” said Wiseway Wang, Executive Vice President and General Manager of the Custom Silicon Platform Division at VeriSilicon. “With full-spectrum capabilities ranging from IP licensing and chip architecture design to system-level software and hardware development, tape-out, packaging and testing, as well as mass production, VeriSilicon offers end-to-end custom silicon services leveraging its extensive design service experience and proven mass production capabilities. The successful mass production of this customer’s chip further validates our strength in high-end silicon design services. Moving forward, we will continue to innovate and improve our offerings, empowering customers to accelerate the launch of differentiated products with efficient, high-quality custom chip solutions.”
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
Mercedes-Benz Shapes Future of Autonomous Computing as Co-Creator of Next-Generation Chip Standards with Athos Silicon
10/09/2025 | Mercedes-BenzMercedes-Benz announced a reference design collaboration with Athos Silicon, a specialized semiconductor company established by former engineers at Mercedes-Benz Research & Development North America, Inc. (MBRDNA).
Taiwan Rejects U.S. Proposal for 50-50 Semiconductor Production Split
10/03/2025 | I-Connect007 Editorial TeamTaiwan stated on October 1 that it will not agree to a U.S. proposal to shift half of its semiconductor production to the United States, despite mounting pressure from Washington over tariffs and chip supply security, according to Reuters.
Intel Shares Surge Following Report of Early Talks to Make Chips for Rival AMD
10/03/2025 | I-Connect007 Editorial TeamIntel shares jumped on October 1, following reports that the company is in early talks to manufacture chips for rival AMD through its foundry business, according to CNBC.
Technica Hosts In-House Visit from PCBAA
10/01/2025 | Technica USADavid Schild, Executive Director of PCBAA (Printed Circuit Board Association of America) visited Technica USA to discuss the activity in the market and the advocacy of the PCBAA. The organization was formed to work on Capitol Hill, educating, advocating and getting congressional support to legislate on behalf of building a stronger PCB and substrate manufacturing base in the U.S.A.