Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
The Knowledge Base: Cultivating Your Brand in the Age of Connection
SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 2
VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones
June 9, 2025 | BUSINESS WIREEstimated reading time: 1 minute
VeriSilicon recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer’s mass-produced smartphones, reaffirming the company’s comprehensive one-stop custom silicon service capabilities in AI vision processing.
VeriSilicon’s AI-ISP custom chip solution can integrate proprietary or third-party Neural Network Processing Unit (NPU) IP and Image Signal Processing (ISP) IP. By combining traditional image processing techniques with AI algorithms, it significantly enhances image and video clarity, dynamic range, and environmental adaptability. The chip solution offers flexible configurations with RISC-V or Arm-based processors, supports MIPI image input/output interfaces, provides LPDDR5/4X memory integration capability, and is compatible with common peripheral interfaces such as UART, I2C, and SDIO. This makes the solution highly adaptable for deployment across various applications including smartphones, surveillance systems, and automotive electronics.
For this collaboration, VeriSilicon designed a low-power AI-ISP system-on-chip (SoC) based on the RISC-V architecture, tailored to the customer’s specific requirements. It also included a FreeRTOS real-time Software Development Kit (SDK). The customized SoC was fully optimized for seamless interoperability with the customer’s main processor platform and has since been successfully deployed in multiple smart devices, achieving large-scale production. This success highlights VeriSilicon’s robust capabilities in heterogeneous computing, software-hardware co-optimization, and system-level integration and verification.
“AI-powered imaging has become a key differentiator in the competitive smartphone market, driving increasing demand for high-performance and low-power image processing solutions,” said Wiseway Wang, Executive Vice President and General Manager of the Custom Silicon Platform Division at VeriSilicon. “With full-spectrum capabilities ranging from IP licensing and chip architecture design to system-level software and hardware development, tape-out, packaging and testing, as well as mass production, VeriSilicon offers end-to-end custom silicon services leveraging its extensive design service experience and proven mass production capabilities. The successful mass production of this customer’s chip further validates our strength in high-end silicon design services. Moving forward, we will continue to innovate and improve our offerings, empowering customers to accelerate the launch of differentiated products with efficient, high-quality custom chip solutions.”
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
U.S. Uses Secret Trackers to Trace AI Chips Diverted to China, Sources Say
08/18/2025 | I-Connect007 Editorial TeamTwo sources told Reuters that U.S. authorities have secretly placed location trackers in some advanced chip shipments they see as at high risk of illegal diversion to China. They said the trackers are intended to locate AI chips that are sent to locations restricted by U.S. export laws, but authorities only examine some shipments.
Magnachip Semiconductor Announces YJ Kim to Step Down as CEO; Current Board Chairman Camillo Martino Appointed Interim CEO
08/14/2025 | PR NewswireMagnachip Semiconductor Corporation today announced that YJ Kim has agreed to step down as CEO and as a member of the Board of Directors, effective immediately. Camillo Martino, Chairman of the Board of Directors, has also been appointed Interim Chief Executive Officer, effective immediately.
Dan’s Biz Bookshelf ‘House of Huawei'
08/14/2025 | Dan Beaulieu -- Column: Dan's Biz BookshelfEva Dou’s "House of Huawei" is one of the most gripping business books I’ve read in years, and believe me, I’ve read my fair share. This is not just another corporate biography. It’s a geopolitical thriller, except every word is true. People have painted the Chinese tech giant Huawei as a villain, a threat, and an enigma in equal measure. However, Dou cuts through the noise and delivers something few Western reporters have managed: a fair, balanced, and thoroughly researched look at the company everyone in tech has an opinion about, but few understand.
Foxconn Research Institute, National Yang-Ming Chiao Tung University Jointly Create a New Era of Spatial Computing
08/08/2025 | FoxconnThis technological breakthrough was achieved by Director Guo Haozhong of the Semiconductor Division of Hon Hai Research Institute and Chair Professor at National Yang-Ming National Chiao Tung University, in collaboration with Group Leader Hong Yuheng, Researcher Xu Yezheng, and Researcher Miao Wenqian of the Semiconductor Division, and a research team led by Assistant Professor Huang Yaowei of National Yang-Ming National Chiao Tung University.
ASMPT Introduces MEGA Multi-chip Bonding Platform
08/06/2025 | ASMPTASMPT SEMI, a leading provider of forward-looking solutions for advanced packaging and semiconductor assembly, sets the standard in precision and speed with its new MEGA multi-chip bonding platform.