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VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones
June 9, 2025 | BUSINESS WIREEstimated reading time: 1 minute
VeriSilicon recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer’s mass-produced smartphones, reaffirming the company’s comprehensive one-stop custom silicon service capabilities in AI vision processing.
VeriSilicon’s AI-ISP custom chip solution can integrate proprietary or third-party Neural Network Processing Unit (NPU) IP and Image Signal Processing (ISP) IP. By combining traditional image processing techniques with AI algorithms, it significantly enhances image and video clarity, dynamic range, and environmental adaptability. The chip solution offers flexible configurations with RISC-V or Arm-based processors, supports MIPI image input/output interfaces, provides LPDDR5/4X memory integration capability, and is compatible with common peripheral interfaces such as UART, I2C, and SDIO. This makes the solution highly adaptable for deployment across various applications including smartphones, surveillance systems, and automotive electronics.
For this collaboration, VeriSilicon designed a low-power AI-ISP system-on-chip (SoC) based on the RISC-V architecture, tailored to the customer’s specific requirements. It also included a FreeRTOS real-time Software Development Kit (SDK). The customized SoC was fully optimized for seamless interoperability with the customer’s main processor platform and has since been successfully deployed in multiple smart devices, achieving large-scale production. This success highlights VeriSilicon’s robust capabilities in heterogeneous computing, software-hardware co-optimization, and system-level integration and verification.
“AI-powered imaging has become a key differentiator in the competitive smartphone market, driving increasing demand for high-performance and low-power image processing solutions,” said Wiseway Wang, Executive Vice President and General Manager of the Custom Silicon Platform Division at VeriSilicon. “With full-spectrum capabilities ranging from IP licensing and chip architecture design to system-level software and hardware development, tape-out, packaging and testing, as well as mass production, VeriSilicon offers end-to-end custom silicon services leveraging its extensive design service experience and proven mass production capabilities. The successful mass production of this customer’s chip further validates our strength in high-end silicon design services. Moving forward, we will continue to innovate and improve our offerings, empowering customers to accelerate the launch of differentiated products with efficient, high-quality custom chip solutions.”
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Rachael Temple - AlltematedSuggested Items
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
PsiQuantum Raises $1 Billion to Build Million-Qubit Scale, Fault-Tolerant Quantum Computers
09/10/2025 | BUSINESS WIREPsiQuantum announced it has raised $1 billion in funding for its Series E round to build the world’s first commercially useful, fault-tolerant quantum computers.
Synopsys, GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
09/05/2025 | GlobalFoundriesSynopsys, Inc. and GlobalFoundries (GF) announced a new collaboration to launch an educational ‘chip design to tapeout’ program for universities worldwide.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.