Tata Electronics, BEL Signed MoU to Advance India’s Ambition for Self-Reliance in Electronics and Semiconductors
June 10, 2025 | Tata ElectronicsEstimated reading time: Less than a minute
Tata Electronics, a pioneering leader in India’s electronics manufacturing sector, today announced a Memorandum of Understanding (MoU) with Bharat Electronics Limited (BEL), a Navratna Public Sector Undertaking (PSU) under the Indian Defence Ministry, specialising in design, development, and manufacture of advanced electronics systems, to advance the development of indigenous electronics and semiconductor solutions in line with the Government of India's vision for self-reliance. This MoU marks a significant step forward for Tata Electronics and BEL in jointly exploring end-to-end solutions to meet domestic requirements. The MoU was signed on June 5, 2025, by Dr. Randhir Thakur, CEO and Managing Director, Tata Electronics and Shri Manoj Jain, Chairman & Managing Director, BEL at Bombay House, Tata Group’s headquarters in Mumbai.
As part of the agreement, Tata Electronics and BEL will explore collaboration opportunities to identify Semiconductor Fabrication (Fab), Outsourced Semiconductor Assembly and Test (OSAT), and design services solutions from Tata Electronics based on the current and future requirements of BEL, including Microcontrollers (MCUs), Systems-on-Chip (SoCs), Monolithic Microwave Integrated Circuits (MMICs), and other Processors. Both companies will also endeavour to develop optimum manufacturing solutions for BEL’s products through knowledge sharing, best practices, and other resources.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Neways Achieves SBTi Validation for Near-term Emissions Reduction Targets
09/01/2025 | Neways Electronics International N.V.Neways Electronics International N.V. commits to reduce absolute Scope 1 and 2 GHG emissions 54.6% by 2033 from a 2023 base year.
KIC Expands Footprint in Mexico to Deliver Faster, Localized Support
08/29/2025 | KICKIC, a leading provider of thermal process solutions for electronics manufacturing, has announced the expansion of its service capabilities in Mexico.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
Kontron Strengthens Defense Aerospace Supply Chain by Appointing Spirit Electronics as Official Distributor
08/28/2025 | BUSINESS WIREKontron, a leading global provider of IoT and Embedded Computing Technology (ECT), announced a strategic distribution agreement with Spirit Electronics, an end-to-end supply-chain services company and value-added distributor of high-reliability components. Under the agreement,