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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Ventec Strengthens Commitment to Halogen-Free PCB Manufacturing in Europe
June 11, 2025 | Ventec International GroupEstimated reading time: 2 minutes
Ventec International Group, the PCB materials innovator, manufacturer, supplier and one-stop shop for copper clad laminates, prepregs, as well as process consumables and PCB manufacturing equipment has established volume inventory of halogen-free FR4.1 and FR15.1 PCB materials at its European hub in Germany.
“Trading conditions worldwide are challenging the supply chains of high-tech manufacturing businesses, resulting in significant changes to EMEA supply chains for halogen-free laminates and prepregs,” commented Mark Goodwin, COO of Ventec. “Our strategic stock investment in these FR4.1 and FR15.1 materials strengthens Ventec’s commitment to Europe’s PCB makers and upholds the industry’s commitment to sustainability. While others take a step back from EMEA, Ventec takes a step forward.”
OEMs often look to halogen-free by design, at the substrate level, for compliance with regulations such as RoHS and REACH. Many others make the choice voluntarily to enhance their products’ environmental credentials. A fast and reliable, long-term supply of halogen free laminate and pre-preg materials for PCB production protects the entire value chain, saving costs and delays to source alternative materials. Ventec’s enhanced local stockholding, at the company’s main European base in Kirchheimbolanden, Germany, enhances resilience and turnaround with direct shipping to customers throughout the region.
In addition to supporting sustainability, halogen-free FR15.1 materials can deliver superior performance such as thermal stability and reliability compared to FR4 / FR4.1 -based substrates. While FR4 formulas such as Ventec’s VT-481 / VT-47 target general-purpose and cost-sensitive applications, halogen-free FR15.1 VT-441V / VT-447V with MOT / RTI ratings over 150°C are often chosen for enhanced thermal performance across a wide range of applications including automotive, industrial and increasing commercial aerospace applications.
Ventec’s FR4.1 and FR15.1 materials, VT-441 / VT-441V and VT-447 / VT-447V, provide outstanding thermal reliability, with low Z-axis coefficient or thermal expansion (CTE) and glass transition temperature (Tg) covering the mid-to-high range from 150°C to 190°C. These phenolic-cured materials are resistant to conductive anodic filament (CAF) formation, with electrical and mechanical parameters equivalent to or better than Ventec’s market leading VT-481 and VT-47 FR4 systems.
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MacDermid Alpha to Address Silver Price Volatility Solutions at ECTC 2026
05/15/2026 | MacDermid AlphaAs volatile silver prices continue to place pressure on semiconductor packaging costs and supply chain predictability, MacDermid Alpha Electronics Solutions will highlight material strategies that help manufacturers reduce dependence on silver without sacrificing reliability, thermal performance, or manufacturing efficiency.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
05/13/2026 | I-Connect007The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.