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Anaya Vardya, President and CEO of American Standard Circuits & ASC Sunstone Circuits, announced that his companies will exhibit at the IEEE International Microwave Symposium (IMS 2025), taking place June 15-20, 2025, at San Francisco’s Moscone Center.
“IMS is the microwave industry’s premier gathering. It gives us the perfect platform to sit down face-to-face with designers, engineers, and sourcing professionals,” Mr. Vardya said. “Our experts will be on hand to discuss the latest breakthroughs in Ultra-HDI miniaturization, Laminated Liquid-Crystal-Polymer (LCP) RF modules, and advanced flex and rigid-flex interconnect solutions—technologies that are redefining size, weight, and performance for high-frequency systems.
Visitors to the American standard booth (#2336) can:
- Review live samples featuring 10 µm lines/spaces and stacked microvias for next-gen Ultra-HDI layouts
- Explore licensed multilayer LCP constructions that deliver exceptionally low loss up to millimeter-wave frequencies
- Discuss flex and long-format rigid-flex builds—including boards up to 30 inches—with IPC-verified reliability
- Schedule in-depth design reviews or factory tours with ASC’s RF/microwave and UHDI engineering teams
Show attendees can meet the ASC team on the show floor in Booth 2336.
Check out these educational offerings from American Standard Circuits | ASC Sunstone:
- The Printed Circuit Designer's Guide to... DFM Essentials
- The Printed Circuit Designer’s Guide to... Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to... Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
- On the Line with...ASC Sunstone: Design for Manufacturing Podcast
Visit I-007eBooks.com to download these and other free titles.
