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StratEdge Marks 40 Years of Innovation at IMS 2025 Booth 336

06/12/2025 | StratEdge
StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, will showcase its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 336.

SEMI MEMS & Sensors Industry Group Invites Proposals for Funding Positioning, Navigation and Timing Technology Advancements

06/12/2025 | SEMI
The MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community, announced a Request for Proposals (RFP) for advanced technology development of positioning, navigation and timing (PNT) components and systems, including their manufacture. The full RFP document includes more information on the proposal submission process.

Micron, Trump Administration Announce Expanded U.S. Investments in Leading-Edge DRAM Manufacturing and R&D

06/12/2025 | Micron
Micron Technology, Inc. and the Trump Administration today announced Micron’s plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D, creating an estimated 90,000 direct and indirect jobs.

'TSMC-UTokyo Lab' Launched to Promote Advanced Semiconductor Research, Education and Talent Incubation

06/12/2025 | TSMC
The University of Tokyo (UTokyo) and TSMC announced the opening of the “TSMC-UTokyo Lab”, dedicated to advancing semiconductor research, education and talent incubation.

Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing

06/11/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
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