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Suggested Items

I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest

05/13/2026 | I-Connect007
The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.

Nolan’s Notes: Our Spotlight on North America

05/05/2026 | Nolan Johnson -- Column: Nolan's Notes
In this issue of SMT007 Magazine, we wrap up our electronics world tour with a final stop in the United States and Canada, where we look at the challenges, opportunities, and geopolitical dynamics affecting the market today. What makes American electronics unique? Key U.S. administration policy decisions, like tariffs, are significantly affecting electronics manufacturing. Others, such as the current conflict with Iran and the associated closures of the Strait of Hormuz, affect the raw materials that feed our supply chain.

May SMT007 Magazine: Putting North America in Focus

05/04/2026 | I-Connect007 Editorial Team
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing. Read this issue of SMT007 Magazine now and see where the region is headed.

Mexico’s Wire Harness Pivot Point

04/22/2026 | Nolan Johnson, SMT007 Magazine
Mexico is a major producer of wire harnesses, but recent U.S. economic policies and Mexico’s domestic issues have had a ripple effect on the industry. Jesus Duarte, vice president of Mexico Assembly Wire Technology and president of Expo Wire Tech, explains the issue in greater depth and how the wire harness industry should respond on its own, rather than just reflect what Tier 1s are doing.

AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging

04/16/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
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