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Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology

06/17/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,

Siemens Collaborates with Samsung Foundry on Advanced Node Product Certifications and EDA Innovation

06/17/2025 | Siemens
Siemens Digital Industries Software announced a significant expansion of its collaboration with Samsung Foundry, including extending certification for many of Samsung’s most advanced process technologies across Siemens’ comprehensive Electronic Design Automation (EDA) portfolio.

Imec, Tokyo Electron Extend Partnership to Accelerate the Development of Beyond-2nm Nodes

06/16/2025 | Imec
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has extended its strategic partnership with Tokyo Electron (TEL), a leading Japanese supplier of semiconductor production equipment.

SEMI Announces Election of Tien Wu, ASE CEO, as International Board Chair

06/12/2025 | SEMI
SEMI, the industry association representing the global electronics design and manufacturing supply chain, today announced that its International Board of Directors has elected Dr. Tien Wu, CEO of Advanced Semiconductor Engineering, Inc. (ASE), as its new chair, and Benjamin Loh, Chair of Comet AG, as its new vice chair, effective immediately, in accordance with the association's by-laws.

StratEdge Marks 40 Years of Innovation at IMS 2025 Booth 336

06/12/2025 | StratEdge
StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, will showcase its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 336.
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