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Advanced Electronics Packaging Digest

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Suggested Items

Q/C Technologies Announces Research Collaboration with Sandia National Laboratories

09/30/2026 | Globe Newswire
Q/C Technologies, Inc.., a developer of next-generation optical computing solutions, announced a collaboration with the Center for Integrated Nanotechnologies (CINT) at Sandia National Laboratories (Sandia) to advance its proprietary optical processing unit (OPU) initiative for artificial intelligence inference.

SMART Photonics, GlobalFoundries Partner on Open-Access Silicon-Photonics Foundry Service

09/24/2026 | GlobalFoundries
SMART Photonics B.V. announced its partnership with GlobalFoundries (GF) to offer a new open access foundry service combining GF’s scalable and production-proven silicon platform with SMART Photonics’ high-volume indium phosphide photonic integrated circuits (PICs), including lasers and modulators.

IMAPS Symposium 2026: The Premier Event for Microelectronics Advanced Packaging

09/04/2026 | IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) will host the 59th International Symposium on Microelectronics (IMAPS Symposium 2026) from September 28 to October 1, 2026, at the Encore Boston Harbor in Everett, Massachusetts.

Foxconn Research Develops 34.1 Tbps Silicon Photonics Technology

07/30/2026 | Foxconn
Foxconn Research Institute, in collaboration with National Yang Ming Chiao Tung University, has developed a 34.132 Tbps ultra-high-capacity silicon photonics transmission technology designed to address growing data bandwidth demands driven by artificial intelligence (AI).

NVIDIA, Broadcom Ramp CPO Switch Production

07/27/2026 | TrendForce
TrendForce's latest research on the optical communications industry reveals that NVIDIA has begun shipping its next-generation Spectrum-X CPO switch to select partners.
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