Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Intel, Exostellar Multi-Cluster Operator: AI Acceleration Without the Bottleneck

07/01/2025 | BUSINESS WIRE
Exostellar, a self-managed AI infrastructure orchestration company, announced a strategic collaboration with Intel to help enterprises deploy, manage, and scale AI workloads more efficiently by combining Intel® Gaudi® AI accelerators with Exostellar’s advanced Kubernetes-Native AI Orchestration, Multi-Cluster Operator.

Siemens Turbocharges Semiconductor and PCB Design Portfolio with Generative and Agentic AI

06/24/2025 | Siemens
At the 2025 Design Automation Conference, Siemens Digital Industries Software today unveiled its AI-enhanced toolset for the EDA design flow.

Northrop Grumman Expanding Its Use of NVIDIA AI Technology to Advance Solutions for Space

06/21/2025 | Northrop Grumman
Northrop Grumman Corporation is expanding its use of NVIDIA technology, including adding space applications to the NVIDIA Omniverse simulation platform and leveraging the NVIDIA Isaac Lab framework for the training, development and deployment of artificial intelligence (AI) for cognitive spacecraft operations.

Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud

06/13/2025 | Cadence Design Systems, Inc.
At NVIDIA GTC Paris, Cadence announced it is providing optimized solutions for the world’s first industrial AI cloud in collaboration with NVIDIA.

Top Tech in Taiwan: IPC's Blueprint to Advance Smart Manufacturing

06/04/2025 | Sydney Xiao, IPC
Renowned as a global hub of innovation and a cornerstone of the electronics industry, Taiwan is leading advancements in technology and manufacturing. A decade ago, IPC established an office in Taiwan, embedding itself deeply in this innovative ecosystem. Now with nearly 200 member companies in the region, IPC remains dedicated to driving standardization, education, and technological progress in Taiwan’s electronics manufacturing sector.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in