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Driving Innovation: Selecting the Right Laser Source

04/28/2026 | Simon Khesin -- Column: Driving Innovation
When I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.

AI Boom Sparks Laser Crunch as Nvidia Tightens Grip on Supply Chain

12/08/2025 | TrendForce
TrendForce’s recent research indicates that high-speed optical interconnects are now central to performance and scalability, especially as AI data centers grow into large clusters.

AV Delivers First Two Multi-Purpose High Energy Laser Systems to U.S. Army

09/04/2025 | BUSINESS WIRE
AeroVironment, Inc. (AV) announced the successful delivery of the first two mobile counter-unmanned aircraft system (C-UAS) prototype Laser Weapon System (LWS) to the U.S. Army Rapid Capabilities and Critical Technologies Office (RCCTO) as part of the first increment of the Army Multi-Purpose High Energy Laser (AMP-HEL) prototyping effort.

The Evolution of Picosecond Laser Drilling

06/19/2025 | Marcy LaRont, PCB007 Magazine
Is it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.

Laser Photonics Propels R&D Efforts in Wafer Marking

02/04/2025 | BUSINESS WIRE
Laser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its recently acquired subsidiary, Control Micro Systems, Inc. (CMS Laser), announced the expansion of their Laser Wafer Marking technology research and development program.
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