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Compal Announces Completion of New Automotive Electronics Facility in Poland, Signaling Strategic Growth in Europe
June 30, 2025 | Compal Electronics Inc.Estimated reading time: 1 minute

Compal Electronics is proud to announce the completion of Phase One of its new manufacturing facility in Czeladź, Silesian Voivodeship, Poland, marking a major milestone in its strategic expansion into the European automotive electronics market.
The new plant is dedicated to the production of automotive electronic parts (AEP), with a particular focus on electronic control units. In the future, the facility will expand its product portfolio to include advanced driver-assistance systems (ADAS) and autonomous driving system (ADS) sensors, reflecting Compal’s commitment to innovation and the evolving needs of the automotive industry.
Phase One of the facility was completed in June 2025, with trial production expected by the end of 2025 and mass production scheduled to begin in 2026. The plant is designed to support a maximum annual capacity of 3.5 million control units, operating seven fully automated assembly and testing lines in a cleanroom and positive pressure environment.
This facility underscores Compal’s dedication to serving European automotive OEMs and Tier-one suppliers locally, enhancing supply chain efficiency and responsiveness. “Our Poland facility represents a significant step forward in our global automotive strategy,” said Arthur Wang, Senior Vice President at Compal AEPBU. “It’s designed to meet the highest standards of quality, sustainability, and technological advancement.”
The facility is expected to achieve ISO 9001:2015 and IATF 16949 certifications, and has been designed to meet the BREEAM “Excellent” rating for sustainable building practices.
The Poland Plan was first announced during a groundbreaking ceremony in July 2024, marking the beginning of Compal’s journey to strengthen its presence in the European automotive electronics sector. A potential Phase Two expansion is under consideration, contingent on future developments in international trade and tariff policies. This strategic move also includes the establishment of a local business development and technical support team, enabling close collaboration with European customers on engineering and product development.
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Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs: