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Advanced Electronics Packaging Digest

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Designers Notebook: Implementing Strategic Planning Principles for PCB Design

09/03/2026 | Vern Solberg -- Column: Designer's Notebook
Developing multiple-processor system-level products involves a broad range of engineering disciplines (commonly referred to as co-design), often led by a designated program manager who divides the development program into technical disciplines. The primary member of this team is the electrical engineer (EE), who prepares the overall schematic diagram of the product. This effort includes simulation and modeling, developing a BOM, and defining all active components and any specialized passive elements (often stipulating preferred or prequalified sources).

United Electronics Corporation Expands Drilling and Routing Capacity with Two New Schmoll Machines

07/22/2026 | United Electronics Corporation
United Electronics Corporation (UEC), a domestic manufacturer of high-reliability printed circuit boards, today announced the installation of two new machines from Schmoll Maschinen GmbH at its Franklin Park facility.

Beyond Design: Skip-layer Routing—The Waveguide Structure That Makes 224G Possible

07/09/2026 | Barry Olney -- Column: Beyond Design
As data rates climb from 112G PAM4 toward 224G PAM4 and beyond, electronics designers are discovering that traditional stripline and microstrip geometries are no longer sufficient. The physics simply break. Rise times are now in the single‑digit picosecond range, loss budgets are measured in millimeters, and even tiny discontinuities can collapse a PAM4 eye.

Every Layer Interconnect: The Promise, the Pain, and the Practical Limits

07/02/2026 | Anaya Vardya, American Standard Circuits
Every layer interconnect (ELIC) is an architectural statement about how a PCB is built, signaling a fundamental shift in how we think about routing density, vertical interconnect, and the relationship between design and fabrication. To understand what ELIC solves, you have to understand what it replaces. Traditional HDI construction uses a rigid core with sequential build-up layers on one or both sides:configurations such as 2-4-2 or 3-2-3.

Common vs. Differential Mode in Routing and Signal Integrity

06/11/2026 | Kristin Moyer, Sacramento State University and Global Electronics Association
In high-speed designs, the distinction between common-mode and differential-mode is becoming increasingly critical in PCB routing. While most designers are familiar with differential routing as a technique for certain signals on the PCB, many may not realize its underlying purpose. Differential routing is used to mitigate differential mode noise in the system. To understand this, we need a bit of electrical engineering background on signal and current flow in a system.
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