Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Libra Industries Launches In-House High Precision Underfill Capabilities

07/17/2025 | Libra Industries
Libra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is excited to announce the addition of high-precision underfill to its in‑house manufacturing capabilities.

YES Delivers Multiple VertaCure LX Systems

07/08/2025 | BUSINESS WIRE
Yield Engineering Systems (YES), a leading provider of process equipment for AI and HPC semiconductor applications, announced the delivery of multiple VertaCure™ LX curing systems to one of Taiwan’s top outsourced semiconductor assembly and test (OSAT) providers.

Xanadu Opens $10M Advanced Photonic Packaging Facility in Ontario

06/25/2025 | PRNewswire
Xanadu, a world leader in photonic quantum computing, has opened a $10M world-leading advanced photonic packaging facility in Toronto. This facility represents a significant leap in Canada's quantum supply chain resilience and technical capacity.

KYZEN to Feature MICRONOX Semiconductor Grade Cleaning Chemistries at CHIPcon 2025

06/24/2025 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the CHIPLET and Heterogeneous Integration Packaging Conference and Exhibition, or CHIPcon, scheduled to take place July 7-10 at the San Jose Marriott

NHanced Semiconductors VP Charles Woychik to Deliver Keynote at SMTA’s Symposium on Counterfeit Parts & Materials

06/18/2025 | NHanced Semiconductors
At the upcoming SMTA Symposium on Counterfeit Parts & Materials, NHanced Semiconductors vice-president Dr. Charles Woychik will deliver a keynote address detailing the critical role of advanced packaging technologies needed to build a more resilient and advanced Outsourced Assembly and Test (OSAT) sector in the U.S. A strategic focus on advanced packaging technologies.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in