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Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S
July 11, 2025 | Nordson Test & InspectionEstimated reading time: Less than a minute
Nordson Test & Inspection today announced that smartTec will expand distribution of X-Ray and Test Solutions to include Denmark, Norway, Finland, Sweden, Latvia, Lithuania and Estonia.
“To build on our strong partnership with Nordson Test & Inspection, we are pleased to expand our distribution of Nordson’s X-Ray and Test portfolio of inspection and metrology solutions in Scandinavia and Baltic countries,” said Lars Bøndergaard, Managing Director of smartTec Nordic A/S, “Nordson has a leading portfolio of differentiated solutions that deliver superior performance for our customers in both semiconductor and SMT markets and they continue to advance both system and software technologies incorporating machine learning (ML), deep learning (DL) and artificial intelligence (AI) to address next-generations applications.”
smartTec Nordic A/S is part of smartTec Gmbh, headquartered in Germany. The expansion of distribution of the X-Ray and Test solutions in the Scandinavia and Baltic countries builds on the strong multi-year partnerships and distribution of Nordson’s X-Ray and Optical inspection and Metrology systems in Europe.
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Nordson Electronics Solutions to Exhibit High-yield Fluid Dispensing Technologies for Panel-level and Wafer-level Packaging at SEMICON Taiwan 2025
08/18/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326.
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Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd