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TRI Unveils New Platform for Diverse Board Sizes
July 14, 2025 | TRIEstimated reading time: Less than a minute

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces a new size configuration for SPI and AOI Models.
The new Size M configuration for selected Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) platforms provides manufacturers with greater flexibility for large-sized board applications, such as EV batteries, data center boards, and more.
The size M configuration has a board handling capability of up to 660 x 690 mm, the lineup includes the TR7007M SIII and TR7007MD/Q SII for SPI, and the TR7700MQ SII, TR7700M SIII Ultra, TR7500M SIII Ultra, and TR7700MQC SII for AOI.
TRI inspection solutions support current Smart Factory and communication standards such as SMEMA, SECS/GEM, IPC-CFX-2591, and IPC-HERMES-9852, ensuring a cost-effective, Industry 4.0-compliant solution for comprehensive defect detection and data exchange.
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Technica to Host Demo Days Event August 13-14
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Koh Young Appoints Tom Hattori as President of Koh Young Japan
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Smarter Machines Use AOI to Transform PCB Inspections
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