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Powering Progress: Summer 2025 Community Magazine Now Available
July 22, 2025 | Community MagazineEstimated reading time: 1 minute

In the new Summer 2025 edition of Community Magazine, members of the newly renamed Global Electronics Association demonstrate what progress really looks like—through innovation on the factory floor, influence on public policy, and investment in the next generation of engineers.
This issue shares the success stories of companies like STI Electronics, Milwaukee Electronics, and Accurate Circuit Engineering. We highlight the people making IPC standards work on the ground, like Debbie McDade and Symon Franklin, whose collaboration sets a high bar for global standardization.
You’ll also meet Emerging Engineers who’ve leveraged APEX EXPO as a springboard for their careers, and discover how Magna Zhangjiagang became the first-ever recipient of the Automotive QML. These stories take you from Japan to India, China to North America.
New in this issue:
- "Evolve," a sustainability framework from the Global Electronics Association, is designed to help manufacturers meet evolving regulatory and customer demands.
- "Advocating for Electronics," spotlighting first-time advocates Mectronx, TCLAD, and Zentech, as they make their voices heard in Washington.
- “Creating Connections in Mexico,” featuring Lorena Villanueva’s media and government outreach across Mexico, and "A Vision for India and Beyond," highlighting Gaurab Majumdar’s rapid growth of education about the Global Electronics Association.
Also inside:
- Economic insights from chief economist Shawn DuBravac
- Global standards and training updates
- Calendar highlights and regional news from China, India, and North America
Whether you’re shaping policy, scaling production, or leading engineering teams, this issue connects the dots between global priorities and local action.
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Rachael Temple - AlltematedSuggested Items
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
North American PCB Industry Shipments Up 20.7 Percent in July
08/27/2025 | Global Electronics AssociationThe Global Electronics Association announced today the July 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00. Total North American PCB shipments in July 2025 were up 20.7% compared to the same month last year.
North American EMS Industry Shipments Down 4.1% in July
08/27/2025 | Global Electronics AssociationThe Global Electronics Association announced today the July 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.23.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.