-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Foxconn, TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
July 30, 2025 | PRNewswireEstimated reading time: 1 minute
Hon Hai Technology Group (Foxconn) and TECO Electric & Machinery Co Ltd Ltd (TECO) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.
The move brings together the strengths of Foxconn, the world's largest electronics manufacturing service provider and AI server producer, and TECO, a leader in industrial electro-mechanical engineering and green energy innovation. Seizing on the development of global AI data center (AIDC) construction towards standardization and modularization, the two companies will jointly explore AIDC business opportunities. Global customers will be able to tap comprehensive data center modular products, electromechanical engineering services, and cost-competitive, one-stop solutions.
According to terms approved by both boards, respectively, TECO will take a 0.519% stake in Hon Hai Precision Industry Co Ltd, the formal name Foxconn trades on at the Taiwan Stock Exchange. In turn, Foxconn will own 10% in TECO. The latter will issue 237,644,068 new shares to Foxconn, and Foxconn will issue 72,481,441 new shares to TECO, implying a share exchange ratio of approx. 1 to 0.305. The no-cash transaction is targeted to complete in fourth quarter of this year, conditional on regulatory approvals.
Foxconn Chairman Young Liu said, "Time-to-market is key in the global super-computing race. Modular design is gaining popularity. As AI data centers grow in size and demand ramps higher, teaming up with TECO means both companies are able to level up and rapidly deliver comprehensive, vertically-integrated solutions to our customers – the Tier-1 CSPs and hyperscalers."
TECO Chairman Morris Li said, "Changing global dynamics are creating new opportunities for business and cooperation. The strategic partnership extends the two companies' cooperation in the fields of low-carbon smart factories and energy services, toward being a one-stop solution for data centers going forward."
Target markets cover Taiwan, Asia, the Middle East and the US. Texas-based TECO-Westinghouse, a world leader in making electric motors, with its US manufacturing and local services, together with Foxconn's US manufacturing base, are in line with the companies' strategic aim to expand US manufacturing and reshape the global supply chain.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Tecore Networks To Rip And Replace Huawei And ZTE Infrastructure In The U.S.
03/18/2020 | Business WireTecore Networks, a U.S. based manufacturer and global supplier of innovative mobile network infrastructure, applauds President Trump in signing into law the Secure and Trusted Telecommunication Network Act.
Altus Adds Vertical Drying Solutions from Rehm to its Portfolio
01/09/2020 | Altus GroupTo maintain the reliability of sensitive electronic sub-assemblies, it is important for the printed circuit board to be coated. This involves a special drying process which ensures the PCB is protected and can withstand any difficult conditions.