-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Brian O’Donnelly Appointed to Expanded Role, Strengthening Global Leadership to Drive Growth in the Fujifilm’s Electronic Materials Business
July 31, 2025 | FujifilmEstimated reading time: 1 minute

FUJIFILM Corporation (President and CEO, Representative Director: Teiichi Goto) today announced that the company has appointed Brian O’Donnelly as its Corporate Vice President, strengthening global leadership to drive growth in the Electronic Materials Business. He will continue serving as the President and CEO of FUJIFILM Electronic Materials USA, Inc., Senior Deputy General Manager of the Electronic Materials Business Division, FUJIFILM Corporation and Global Vice President of FUJIFILM Electronic Materials.
Born and educated in Scotland, O’Donnelly has spent the majority of his 40-year career working in the Chemical and Semiconductor Materials industries, joining Fujifilm group in 2004. In 2014, he was appointed President and CEO of FUJIFILM Electronic Materials USA, where he has led significant growth of the business and its contributions to Fujifilm through new product development, customer and product portfolio expansions, and mergers and acquisitions.
“Brian is a strong leader who has long contributed to the development of the Fujifilm’s Electronic Materials business, not just in North America, but also globally through strategic acquisitions and integrations that have allowed us to expand our portfolio of products and services to meet the needs of the world’s top semiconductor manufacturers,” said Tetsuya Iwasaki, Director, Senior Vice President and General Manager of the Electronic Materials Business Division, who leads the global business.
Prior to joining Fujifilm, O’Donnelly worked for Olin Corporation’s Materials Metal Research Labs in R&D, as well as Arch Chemicals, where he held progressively more senior roles in finance, strategic planning, M&A and business management within its Chemicals and Electronic Materials Divisions.
“I am looking forward to continuing to help our global business realize its full growth potential and be the leading and most trusted Electronic Materials partner in the global semiconductor industry,” said O’Donnelly. “As Corporate Vice President at FUJIFILM Corporation, I am honored to contribute to the company’s commitment to global diversity and to be part of an inclusive leadership culture that reflects our expanding global business portfolio.”
O’Donnelly holds a PhD in Metallurgy from the University of Strathclyde in Glasgow, Scotland. He earned his MBA in Finance & Strategy Planning from the University of New Haven in Connecticut.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Creative Materials to Showcase Innovative Functional Inks for Medical Devices at COMPAMED 2025
10/09/2025 | Creative Materials, Inc.Creative Materials, a leading manufacturer of high-performance functional inks and coatings, is pleased to announce its participation in COMPAMED 2025, taking place November 17–20 in Düsseldorf, Germany.
Jiva Leading the Charge Toward Sustainable Innovation
09/30/2025 | Marcy LaRont, PCB007 MagazineEnvironmental sustainability in business—product circularity—is a high priority these days. “Circularity,” the term meant to replace “recycling,” in its simplest definition, describes a full circle life for electronic products and all their elements. The result is re-use or a near-complete reintroduction of the base materials back into the supply chain, leaving very little left for waste. For what cannot be reused productively, the ultimate hope is to have better, less harmful means of disposal and/or materials that can seamlessly and harmlessly decompose and integrate back into the natural environment. That is where Jiva and Soluboard come in.
Space Forge Inc. and United Semiconductors LLC Partner to Develop the Supply Chain for Space-grown Semiconductor Materials
09/29/2025 | Space Forge Inc.Space Forge Inc., the advanced materials company revolutionizing semiconductor manufacturing in space, has announced the signing of a strategic Memorandum of Understanding (MoU) with United Semiconductors LLC, a leading specialist in bulk crystal growth of III-V semiconductor compounds. The agreement formalizes the ongoing collaborative efforts that started over a year ago, marking a significant step forward in strengthening the partnership between the two companies.