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Magnalytix, providing real-time reliability solutions for electronics manufacturing, is excited to announce that Dr. Mike Bixenman will present the professional development course “The Effects of Flux Residues and Process Contamination on the Reliability of the Electronic Assembly” on Wednesday, Aug. 13 at 9:00 AM CST to open the second day of the STMA High-Reliability Cleaning and Conformal Coating Conference.
The course will focus on defining the acceptable cleanliness of flux and process residues considering the many factors that contribute to electrochemical reliability of electronic assemblies. Bixenman will utilize electrical test data and a variety of populated test boards to exemplify the numerous factors that drive reliability and provide best practices to help process engineers qualify and control their production hardware to meet acceptable levels of process contamination.
Due to the contemporary demands placed upon electronic hardware, the need for reliability of electronics is at an all-time high and facilitated by the miniaturization of devices. With miniaturization, issues arise with the presence of flux and process contamination, which are often shielded during visual inspection of finished assemblies. Through the course, Bixenman aims to help attendees understand the effects of process residues used to build and clean assemblies, allowing them carry that information into their own processes and keeping reliability in-mind as electronic hardware and industry demands continue to evolve.
For more information about the technical conference or to register to attend, visit the official website of SMTA High-Reliability Cleaning and Conformal Coating Conference.
