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Learning With Leo: UHDI—The Next Leap in PCB Manufacturing

11/05/2025 | Leo Lambert -- Column: Learning With Leo
High density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.

Trouble in Your Tank: Understanding Interconnect Defects, Part 1

11/04/2025 | Michael Carano -- Column: Trouble in Your Tank
This month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.

Molex Announces Agreement to Acquire Smiths Interconnect

10/17/2025 | Molex
Molex, a leading global electronics connectivity innovator, announced that it has signed an agreement to acquire Smiths Interconnect.

Advanced Packaging-to-Board-Level Integration: Needs and Challenges

09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics Association
HPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.

Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer

09/09/2025 | Summit Interconnect, Inc.
Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO). 
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