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Advanced Electronics Packaging Digest

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Suggested Items

Every Layer Interconnect: The Promise, the Pain, and the Practical Limits

07/02/2026 | Anaya Vardya, American Standard Circuits
Every layer interconnect (ELIC) is an architectural statement about how a PCB is built, signaling a fundamental shift in how we think about routing density, vertical interconnect, and the relationship between design and fabrication. To understand what ELIC solves, you have to understand what it replaces. Traditional HDI construction uses a rigid core with sequential build-up layers on one or both sides:configurations such as 2-4-2 or 3-2-3.

MicroLED Interconnect Market to Reach $722M by 2033

06/16/2026 | PRNewswire
The global MicroLED interconnect market is entering a period of accelerated growth as artificial intelligence (AI), high-performance computing (HPC), and next-generation data center architectures drive demand for faster, more energy-efficient communication technologies.

SCHMID Group Records More than €26 Million Order Intake since Mid-May

06/16/2026 | Globe Newswire
SCHMID Group announces a strong combined order intake of more than €26 million since mid-May 2026, reflecting multiple customer orders and continued market momentum in advanced PCB and substrate manufacturing technologies for AI infrastructure and next-generation optical module supply chains.

QTREX Quantum's AME Technology Hits 97% Yield at Major U.S. Interconnect Manufacturer

06/16/2026 | Globe Newswire
QTREX Quantum Ltd. a company focused on advancing Additively Manufactured Electronics (AME) for quantum computing infrastructure, announced that one of the largest U.S.-based interconnect manufacturers has moved QTREX’s AME system from a development environment onto its production floor following an extensive validation program.

Optical Interconnects Drive AI Factory Growth; CPO/NPO Market to Top $39B by 2030

06/15/2026 | TrendForce
TrendForce’s recent research on silicon photonics (SiPh) shows that the rapid growth of AI training and inference workloads is pushing AI data centers toward increased power use, higher rack densities, and larger clusters.
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