Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Keysight Accelerates AttoTude IC Design Cycles by Over 50%

08/28/2026 | BUSINESS WIRE
Keysight Technologies, Inc. announced that AttoTude Inc., a pioneer of next-generation ASICs over Dielectric interconnect technology for AI and hyperscale data center applications, has expanded its use of Keysight EDA software to manage its full IC design workflow.

VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.

All Flex Expands Reach Through Flex Interconnect Technologies Acquisition

08/19/2026 | Marcy LaRont, I-Connect007
A strategic partnership between Minnesota-based All Flex Solutions and Flex Interconnect Technologies (FIT) will provide value-added engineering and quick-turn, prototype flexible PCB manufacturing with All Flex’s high-volume flex fabrication. The new alliance offers customers a more comprehensive flex solution and an opportunity to streamline their flex PCB supply chain. All Flex CEO John Fallon discusses the strategic rationale behind the partnership, the benefits of having a “100-year plan,” and how the combined organization is positioning itself for optimum growth.

3 Key Takeaways: A New Approach to Die Topside Interconnection

07/15/2026 | I-Connect007
Every advance in power electronics places new demands on semiconductor packaging. As manufacturers push for greater power density, improved thermal management, and smaller form factors, even long-established interconnection methods deserve a fresh look. In its latest white paper, MacDermid Alpha Electronics Solutions examines how a sinter-ready copper foil solution could simplify die topside interconnection while improving performance.

CIL Awarded Investors in People

07/14/2026 | CIL
Custom Interconnect Ltd (CIL), a leading provider of Outsourced Semiconductor Packaging and Test (OSAT), EMS and full product build solutions, is proud to announce that it has been awarded the highly respected Investors in People (IIP) Accreditation, recognising the company's commitment to supporting, developing, and empowering its employees.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in