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Advanced Electronics Packaging Digest

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Suggested Items

MKS’ Atotech Showcases Advanced PCB Solutions at CPCA Show Plus 2026

10/21/2026 | MKS Inc.
MKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will present their latest manufacturing solutions for printed circuit board (PCB) and package substrate production at CPCA Show Plus 2026.

Optimizing the Interconnect with Dr. John T.C. Lee

10/21/2026 | Marcy LaRont, I-Connect007 Magazine
When Dr. John T.C. Lee talks about the evolution of electronics, he keeps coming back to the interconnect. As CEO and President of MKS Inc., he saw growing complexity in the connections between increasingly powerful devices as both a manufacturing challenge and a business opportunity. That thinking helped drive MKS’ acquisition of Atotech in 2022, bringing process chemistry and electroplating together with MKS’ existing strengths in lasers, optics, and precision motion, and giving substance to a strategy the company calls Optimize the Interconnect™.

TTM Technologies Plans $400M AI Infrastructure Investments in China and Malaysia

10/12/2026 | Globe Newswire
This expansion initiative represents incremental investments to the previously disclosed commitment to invest $1.2 billion through the 2025-2029 timeframe and is buttressed by ongoing discussions with our long-standing customer partners indicating expected demand increases.

Applied Materials, Besi Expand Strategic Partnership

10/02/2026 | Applied Materials
Applied Materials, Inc. and BE Semiconductor Industries N.V. (Besi) announced an expansion of their longstanding strategic partnership, with Besi joining Applied's EPIC Center as an Innovation Partner.

CScale Exits Stealth With $145M to Build AI Interconnects

09/30/2026 | BUSINESS WIRE
CScale exited stealth, announcing $145 million in Series C funding to accelerate development and commercialization of optical interconnect for AI scale-up, the high-bandwidth, ultra-low-latency connections that let accelerators work together like a single, much larger computer.
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