Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

WORKS Optimization from ASMPT

08/21/2025 | ASMPT
WORKS Optimization from technology and market leader ASMPT is a software solution for quality-oriented and integrated process monitoring in SMT manufacturing.

New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect

08/26/2025 | I-Connect007
In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.

Alpha and Omega Semiconductor Announces Advanced eFuse that Meets High Reliability Server Application Requirements

08/13/2025 | Alpha and Omega Semiconductor
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, announced the release of its AOZ17517QI series, a 60A eFuse in a compact 5mm x 5mm QFN package.

Atg Launches Latest Large Format Test System, A9XL, with 8 Heads and 48” x 26” Panel Capability

08/04/2025 | atg Luther & Maelzer GmbH
atg Luther & Maelzer GmbH (a Mycronic company) is proud to roll out a new large format test system generation based on the latest high speed atg A9 (board size up to 24” x 21”) and A9L platform.

Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress

08/04/2025 | Michael Carano -- Column: Trouble in Your Tank
Metallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in