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IMI Reports US$7.6 Million of Net Income for the First Half of 2025
August 7, 2025 | IMIEstimated reading time: 1 minute
Integrated Micro-Electronics, Inc. (IMI), a global leader in electronics manufacturing services, announced its financial results for the first half of 2025, reporting a net income of US$7.6 million, a significant turnaround from a net loss of US$8.8 million in the same period last year.
Group revenues reached US$497 million, with core revenues contributing US$446 million. Core EBITDA rose to US$32.6 million, representing a 7.3% margin, while core net income grew to US$9.8 million, up from US$3.7 million in 2024.
This positive shift was primarily driven by operational efficiency initiatives and disciplined cost control. The company achieved a US$16.5 million reduction in core fixed overhead and SG&A expenses, with an additional US$11.4 million in cost savings from VIA Optronics. In addition, a 201 basis point improvement in direct material cost ratio was achieved through enhanced supply chain strategies and the adoption of alternative components.
IMI cash reserves increased to US$123 million while reducing total debt to US$271 million.
“Our first-half results reflect strong progress toward our group EBITDA margin target, with our core business already delivering a 7.2% margin,” said Louis Hughes, Chief Executive Officer of IMI. “Despite ongoing market softness, we are collaborating closely with customers to optimize material costs and drive profitability. Our focus on operational efficiency remains firm.”
On July 31, IMI successfully completed the sale of its Czech Republic facility for €10 million. Highvalue customers from the site have been transitioned to IMI’s Bulgaria and Serbia operations, enhancing both service and profitability.
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Atg Launches Latest Large Format Test System, A9XL, with 8 Heads and 48” x 26” Panel Capability
08/04/2025 | atg Luther & Maelzer GmbHatg Luther & Maelzer GmbH (a Mycronic company) is proud to roll out a new large format test system generation based on the latest high speed atg A9 (board size up to 24” x 21”) and A9L platform.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/01/2025 | Nolan Johnson, I-Connect007We start with the latest report from the Global Electronics Association: North American PCB sales are down 8.6% in June. That might sound grim, but keep reading—there’s more to the story. Bookings are holding steady, and Dr. Shawn DuBravac offers context that paints a more balanced picture. Next, we turn our gaze to India, where mobile phone exports have surged 127-fold over the past decade. That stat alone says volumes about India’s emergence as a force in electronics manufacturing, something we’ll be digging into more deeply in an upcoming SMT007 feature.
New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI
07/28/2025 | I-Connect007The Optimize the Interconnect podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the Interconnect is gaining traction across the industry.
New Podcast Series Launches: Optimize the Interconnect
07/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.