Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

ASMPT Announces Strategic Optimization of Manufacturing Operations, Closes Shenzhen Factory

08/11/2025 | ASMPT
ASMPT, a global leader in semiconductor and electronics manufacturing, announced today a strategic optimization of its manufacturing operations in China.

ASMPT Introduces MEGA Multi-chip Bonding Platform

08/06/2025 | ASMPT
ASMPT SEMI, a leading provider of forward-looking solutions for advanced packaging and semiconductor assembly, sets the standard in precision and speed with its new MEGA multi-chip bonding platform.

ASMPT Earns Global Recognition for Outstanding Customer Service in 2025 TechInsights Survey

07/31/2025 |
ASMPT has been recognised for excellence in the 2025 TechInsights Global Semiconductor Supplier Survey for the 12th consecutive year. This year, it was ranked third for excellence in customer service among large equipment suppliers.

Technica USA Hosts ASMPT Management Team for Midyear Business Review

07/22/2025 | Technica USA
Technica USA was pleased to host the management team from ASMPT for a strategic midyear business review at its headquarters in San Jose, California.

ASMPT Introduces AERO PRO High-Performance Wire Bonder

07/09/2025 | ASMPT
ASMPT, the world’s leading provider of hardware and software solutions for semiconductor and electronics manufacturing, introduces its latest high-performance wire bonder: the AERO PRO.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in