ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions
September 8, 2025 | ASMPTEstimated reading time: 1 minute
ASMPT, the world's leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced the appointment of Mr. Gordon Lam as Chief Commercial Officer for Semiconductor Solutions (SEMI Solutions).
Gordon joined ASMPT in August with over 25 years of key leadership experience in various global technology and enterprise solutions organizations. As Chief Commercial Officer for SEMI Solutions, he is responsible for driving the commercial strategy for its strong semiconductor assembly and packaging solutions portfolio to accelerate growth across key market segments, while adding value to and strengthening customer relationships.
Most recently, Gordon served as Chief Revenue Officer, President, and Operating Committee Member at Syniti, where he led global go-to-market strategies and drove significant business transformation. He previously held senior leadership roles at NetApp, SAP, Computer Sciences Corporation, and Microsoft, bringing extensive experience across hardware, software, and enterprise solutions. With deep expertise in sales management, strategic planning, and operations, Gordon has a proven track record of delivering multi-year growth and profitability in highly competitive markets.
"Gordon's extensive commercial leadership experience and proven ability to drive growth in complex technology markets make him an ideal fit for ASMPT as we continue to capitalize on the strong demand dynamics in advanced packaging and AI-driven semiconductor applications,” said Robin Ng, Chief Executive Officer of ASMPT. “His appointment reinforces our commitment to strengthening our commercial capabilities and deepening our customer partnerships globally."
"I'm thrilled to join ASMPT as Chief Commercial Officer at a pivotal moment for our industry. Our comprehensive semiconductor assembly and packaging solutions are an exceptional platform for customer success,” explained Gordon. “With strong market demand for advanced semiconductor technologies, I am focused on strengthening customer partnerships and accelerating our commercial strategy, focusing on next-generation packaging and processing applications."
Gordon holds a dual degree in Electrical Engineering and Computer Science from UNSW and completed the Senior Executive Leadership Program at Stanford University. He is also a contributing member of the Forbes Technology Council.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
AMD’s Lisa Su to Receive Inaugural SEMI Silicon Medal at SEMICON West 2025
09/08/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced the introduction of the annual SEMI Silicon Medal, a prestigious award that celebrates semiconductor industry icons driving innovation and excellence.
Synopsys, GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
09/05/2025 | GlobalFoundriesSynopsys, Inc. and GlobalFoundries (GF) announced a new collaboration to launch an educational ‘chip design to tapeout’ program for universities worldwide.
SEMI Reports Global Semiconductor Equipment Billings Increased 24% Year-Over-Year in Q2 2025
09/05/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report that global semiconductor equipment billings increased 24% year-over-year to US$33.07 billion in the second quarter of 2025.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON West
09/03/2025 | Koh YoungKoh Young Technology, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications at SEMICON West 2025 in Booth 5949.