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Test & Research India PVT, LTD. (T&R India), TRI's distributor, will join SEMICON India 2025 at Yashobhoomi (IICC), New Delhi, India from September 2 – 4, 2025.
Visit booth No. 1413 to experience the latest in Inspection and Metrology for the advanced packaging and semiconductor industry.
T&R India will exhibit TRI's AI-powered 3D AOI for Back-end applications, TR7700Q SII-S, with capabilities to inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The TR7700Q SII-S is equipped with a 2.5um high-resolution 25MP camera, AI solutions, and Precise Metrology measurements.
TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology, μBump, Cu Pillar, Surface Topology, Profiling, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.
