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Advanced Electronics Packaging Digest

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Infineon to Build Europe’s First 300mm GaN Power Semiconductor Fab

10/27/2026 | Infineon
Infineon Technologies AG is establishing the world’s first high-volume manufacturing facility for next-generation gallium nitride (GaN) power semiconductors on 300-millimeter wafers in Europe.

Nordson Completes Contrinex Acquisition to Expand Sensing Portfolio

10/26/2026 | Nordson
Nordson Corporation announced that it has acquired Contrinex, a global technology leader in high-performance sensors supporting factory automation and related solutions.

What It Takes to Test Automotive Power Electronics Assemblies

10/21/2026 | Francesca Pinto, SPEA
Power electronics board assemblies are central to modern vehicle power systems. They include voltage regulators, motor drivers, inverters, DC-DC converters, and onboard chargers, which are found across the range of today's vehicles, from conventional combustion engines to hybrids and full electric vehicles. However, modern power PCBAs do far more than just route and manage electrical energy flow through the vehicle, converting and regulating power for everything from the starter and alternator to the traction motor.

Neways, SRC Partner on Advanced European Defense Technology

10/20/2026 | Neways
Neways, the global innovator in mission-critical technology for leading semicon, defense & mobility, and connectivity companies, has signed an agreement with SRC, Inc., a not-for-profit U.S. research and development corporation specializing in developing, manufacturing and servicing advanced defense technologies.

Hitachi Energy, Ansaldo Energia Partner on Integrated Power Solutions

10/19/2026 | Hitachi Energy
Hitachi Energy and Ansaldo Energia signed a Memorandum of Understanding to develop and market integrated power solutions designed to help customers secure reliable power faster and meet rapidly growing electricity needs with greater flexibility, resilience and speed.
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