BEST Inc. Provides High-Reliability BGA Reballing and Component Rework Services

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BEST Inc., a leader in electronic component services, is pleased to announce its component rework services are available for all types of area array devices including ball grid array, land grid array and quad flat no-lead SMT packages.

When it comes to reballing BGAs, there are many options out there to choose from. The BEST advantage comes from our 20 plus years of reballing experience and our ability to make custom reballing performs to fit nearly any package. By making preforms in-house, we significantly reduce lead-times for our customers for both small and large volume jobs.

LGA rework can save you weeks of delays and a large amount of money. A well-executed rework protocol will let you meet your project deadlines when it looks like a delay is inevitable. BEST has done just that for countless customers ranging from large corporations to small shops, many with complex documentation requirements needed for assurance in reliability-critical industries.

Consistent, repeatable, and above all reliable LGA rework calls for advanced soldering processes and highly skilled technicians. LGA rework often requires custom designed apertures and stencils, repair of board solder masking, and often even the bonding of new pads to the PCB. Once the rework is complete, endoscopic and X-ray inspection of the board assures the integrity and reliability of the rework. Our expertise and care in harvesting LGAs from circuit boards when components are not readily available is a service that companies rely on BEST to perform.

Dependable QFN rework takes advanced processes and a high level of skill. QFN rework may require designing custom stencils and apertures, solder mask repair, and bonding new pads to the board. The right QFN rework process will bump the pads on these leadless devices, making rework and placement easier. Finally, the integrity of the QFN rework is assured using endoscopic and X-ray inspection of the joints. BEST's engineers were even instrumental in suggesting several IPC procedures for reworking these types of devices.

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