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OKI will launch Comprehensive Electronics Manufacturing Services (EMS) for AI server equipment on March 25, 2026. These comprehensive services will cover all processes, from the design and production of large-size multi-layer printed circuit boards (PCBs) incorporating OKI’s proprietary high heat dissipation technology supporting high-speed high-capacity data transmission, to component procurement, PCB component mounting, system assembly, testing, and reworking. Targeting AI server equipment manufacturers, OKI aims for sales of JPY 1 billion in FY2026.
As generative AI continues to advance at an accelerating pace, dealing with the ever-expanding volume of information and securing sufficient computing resources have become critical challenges. The computing resources required for generative AI training and inference are several hundred times greater than for conventional cloud-based services. This has led to surging demand for AI servers that feature densely mounted AI semiconductors designed for AI data centers, including graphics processing units (GPUs) and high-bandwidth memory (HBM).
AI server equipment production lines face multiple challenges, including achieving high component placement accuracy; managing warping and interference caused by differences in thermal expansion between PCBs and components during high-temperature heating; countermeasures for the heat generated by large numbers of AI semiconductors in operation; detecting solder defects inside contact points that cannot be identified by AOI (Note 1); and handling growing numbers of inspection items. Other challenges involve expanded traceability requirements and the growing difficulty of rework (Note 2) after mounting large and costly AI semiconductors, which have led to lower production yields, greater failure costs due to defective product disposal, and longer production lead times.
Through these new services, OKI will provide high-density mounting technology for large-size multi-layer PCBs for AI semiconductors, cultivated through the manufacturing of semiconductor testing equipment and information and communications infrastructure equipment requiring high-speed, high-capacity data transmission, as well as simulation and manufacturing technologies for multi-layer PCBs incorporating its proprietary PCB technology with embedded copper coin for high heat dissipation. In addition, OKI will draw on its high-speed X-ray solder inspection technology, technology to automate functional testing, and its high-mix low-volume production technology and skills for high-quality, high-reliability products to achieve high yields and shorter production lead times for AI server equipment.
On conventional production lines, reworking can be difficult if semiconductor defects are discovered after board mounting. This is especially true for expensive, long-lead-time components featuring fine-pitch elements and high-density mounting. OKI relies on a reworking line that combines proprietary jigs and handwork by OKI EMS’s skilled technicians with advanced soldering techniques to provide short-lead-time reworking, even for AI semiconductors with over 10,000 pins. This allows customers to expect improved yields, reduced failure costs, shorter delivery times, and further improvements in management efficiency.
