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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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NVIDIA, Broadcom Ramp CPO Switch Production

07/27/2026 | TrendForce
TrendForce's latest research on the optical communications industry reveals that NVIDIA has begun shipping its next-generation Spectrum-X CPO switch to select partners.

Tower Semiconductor with METI Support Announces Strategic Capacity Expansion in Japan

07/20/2026 | Tower Semiconductor
Tower Semiconductor, a leading foundry of high-value analog semiconductor solutions, announced a parallel dual-track strategic expansion of its 300mm Silicon Photonics (SiPho), Silicon Germanium (SiGe), and advanced packaging capabilities in Japan, with support from the Government of Japan.

Q/C Technologies Relocates HQ to San Francisco for Photonic Computing Push

06/30/2026 | Globe Newswire
Q/C Technologies, Inc. announced that it has relocated its headquarters to San Francisco, California, as part of its plan to develop a proprietary optical processing unit (OPU) capable of overcoming the heightened performance and energy constraints of today’s artificial intelligence inference infrastructure.

Quantum Computing Completes Acquisition of NHanced Semiconductors

06/24/2026 | Quantum Computing
Quantum Computing Inc., an innovative, quantum optics and integrated photonics technology company, announced the completion of acquiring NHanced Semiconductors, Inc., for a combination of cash and QCi stock valued at $73.1 million, subject to customary adjustments, and up to an additional $72.0 million if certain performance targets are achieved.

Coherent Secures $50M CHIPS LOI to Expand AI Infrastructure Manufacturing

06/18/2026 | Coherent
Coherent Corp., the global photonics leader, today announced it has signed a letter of intent to receive up to $50 million in direct funding under the CHIPS and Science Act from the U.S. Department of Commerce to expand its world-leading 6-inch Indium Phosphide (InP) semiconductor manufacturing facility in Sherman, Texas.
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