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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Nordson Test & Inspection to Unveil SonoFlex Acoustic Inspection System at SEMICON West 2026

09/21/2026 | Nordson Test & Inspection
Nordson Test & Inspection, a global leader in inspection, metrology, and testing solutions, will showcase its comprehensive portfolio of industry-leading optical, X-ray, acoustic inspection, and metrology technologies powered by the Nordson Intelligence™ Ecosystem at SEMICON West 2026, October 13–15, in Booth 5844 at the Moscone Center in San Francisco, California.

Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection

09/16/2026 | PRNewswire
Spirox, hosted the Advanced Packaging Technology Forum, bringing together experts from Corning and DNP to share insights on Glass Core, TGV, reliability, and inspection technologies for next-generation AI and HPC applications.

Closing the Gap: Measuring 20-µm Spacing in Advanced SiP Packaging

09/18/2026 | Axel Lindloff, Koh Young Europe
Twenty microns does not leave much room for error. As advanced packaging increases functional density, the distance between neighboring devices is shrinking to dimensions that create an entirely new set of inspection challenges. In some system-in-package (SiP) applications, components approximately 200 to 300 µm tall can be separated by gaps of only 20 to 30 µm. Measuring those spaces accurately requires considerably more than simply increasing camera magnification. The challenge is optical access.

Yamaha Delivers Big Gains in Small Space as Miltronik Invests in YRi-V 3D AOI

09/15/2026 | Yamaha Robotics Factory Automation
A lack of floorspace and legacy constraints could have prevented design and manufacturing specialist Miltronik from taking the next step in continuously improving production capabilities. Yamaha Robotics’ YRi-V dual-lane AOI system overcame that barrier and enabled the company to go further by upgrading two assembly lines in the space of one.

Koh Young Brings Advanced Packaging Inspection and Metrology Solutions to SEMICON West 2026

09/15/2026 | Koh Young
Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will showcase its growing portfolio of inspection and metrology technologies for semiconductor and advanced packaging applications at SEMICON West 2026, October 13–15 at the Moscone Center in San Francisco, California.
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