SEMICON Taiwan 2025 Hits Record Global Participation Amid AI-Driven Industry Shift

Estimated reading time: 2 minutes

SEMICON Taiwan 2025 enters its final countdown, spotlighting the global AI chip boom and the industry’s rapid transformation. Widely seen as the barometer of the global semiconductor industry, SEMICON Taiwan has hit a new pre-registration record this year. Celebrating its 30th anniversary by kicking off a full International Semiconductor Week, the event will gather 1,200+ companies, 4,100 booths, and industry partners from 56 countries. It opens with forums on September 8, followed by the exhibition at Taipei Nangang Exhibition Center, September 10-12.

Advanced Process Capacity Surges as Global Demand Accelerates

Soaring AI demand is fueling rapid semiconductor growth, with SEMI projecting sub-7nm capacity to reach a record 1.4 million wafers per month by 2028, a 69% jump from 2024. Leveraging robust ecosystems and resilient supply chains, the region continues to play a critical role in supporting global AI chip production. “The AI-driven growth wave is reshaping the industry,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “As the industry shifts to cross-domain collaboration, leading system companies are forging closer partnerships across the semiconductor value chain.”

Record International Participation Positions SEMICON Taiwan 2025 as a Global Hub

Fueled by Taiwan’s strength in AI semiconductors and its comprehensive ecosystem, SEMICON Taiwan 2025 will feature a record-high 17 national pavilions, including first-time participants from Canada, Costa Rica, Lithuania, Sweden, and Vietnam. Beyond record country pavilion participation, international delegations from the U.S., Chile, Spain, Italy, and more are visiting independently, underscoring the exhibition’s global appeal and growing role in industry collaboration.

SEMICON Taiwan Leads Industry Dialogue and Fosters Innovation

SEMICON Taiwan 2025 will serve as a global platform with high-profile forums and specialized zones addressing AI-driven breakthroughs and supply chain resilience. On September 9, the IC Forum-Advanced Chip Technology and Manufacturing will feature TSMC, ASML, and Applied Materials, while the Semiconductor Cybersecurity Global Summit on September 12 will mark the official launch of SEMI E187 Certification. SEMI E187 is the world’s first semiconductor equipment cybersecurity standard led by Taiwan. By establishing a trusted certification system, it allows suppliers to demonstrate compliance, strengthens the entire supply chain, and empowers fabs to confidently integrate safer equipment, minimizing their exposure to cyber risks. With participating leaders including Foxconn and ITRI, discussions will focus on proactive strategies to safeguard the AI-era semiconductor supply chain.

The AI Technology Zone will present the full value chain, from chip manufacturing and IC design to specialized hardware, featuring leaders such as Advantech, ASE, ASM, Aspeed, Egis Technology, and Zhen Ding. Addressing the need for a secure and reliable supply chain, the Semiconductor Cybersecurity Pavilion will showcase solutions in industrial control security and zero-trust architecture, providing comprehensive support for the AI era.